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Chromium-Silicon Alloy Sputtering Target (CrSi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The CrSi sputtering target requires bonding to a backing plate using indium or elastomer bonding to ensure thermal management during deposition. The target must be operated within specified DC/RF power density ranges and argon pressure to achieve optimal film properties.
- Bonding and Backing Plate Constraints: The target must be bonded to an oxygen-free copper or CuCrZr backing plate using indium or elastomer bonding to maintain thermal contact and prevent cracking.
- Sputtering Power and Pressure Limits: DC magnetron sputtering must be performed at 3-15 W/cm² and RF at 1-5 W/cm² under 0.5-2.0 Pa Ar atmosphere to avoid target damage and ensure stoichiometric transfer.
- Deposition Rate and Uniformity Constraints: Deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate are achievable under optimized conditions.
- Adhesion Strength Requirement: Deposited films must exhibit adhesion strength >15 MPa per ASTM D4541 on properly prepared substrates.
- Purity and Contamination Limits: Total metallic impurities must be <1000 ppm and O+N <200 ppm to minimize film contamination and ensure resistivity control.
What deposition rate and thickness uniformity can be expected from the CrSi sputtering target under DC magnetron sputtering?
Under DC magnetron sputtering at 3-15 W/cm² and 0.5-2.0 Pa Ar, the CrSi target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate, as specified in the product documentation.
What are the recommended power density and atmosphere conditions for RF magnetron sputtering of the CrSi target?
For RF sputtering, the CrSi target is optimized at 1-5 W/cm² under 0.5-2.0 Pa Ar atmosphere. The target supports both DC and RF magnetron sputtering, with maximum power density ranges specified for each mode.
What bonding and backing plate options are available for the CrSi sputtering target, and how do they affect thermal management?
The CrSi target offers optional indium bonding or elastomer bonding, and backing plates of oxygen-free copper or CuCrZr. These options influence thermal conductivity and heat dissipation during high-power sputtering, with indium bonding providing superior thermal contact for demanding applications.
Technical evaluation of the CrSi sputtering target (99.9% purity, 3 in diameter x 0.25 in) reveals controlled stoichiometric transfer capability under optimized magnetron sputtering conditions, with high adhesion strength and low impurity levels, but requires careful parameter optimization and explicit specification of bonding and backing plate configuration for successful deployment.
Positive
- Controlled stoichiometric transfer: CrSi alloy composition enables stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions, ensuring reproducible film composition.
- High purity and adhesion strength: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, and deposited films exhibit adhesion strength >15 MPa (ASTM D4541) on properly prepared substrates, supporting reliable thin-film performance.
Trade-offs
- Requires optimized sputtering parameters: Stoichiometric transfer accuracy of ±2 at% is achieved only under optimized sputtering conditions, demanding precise control of power density, pressure, and substrate preparation to avoid composition drift.
- Bonding and backing plate must be specified: Bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) are optional, requiring explicit selection and configuration before ordering to ensure compatibility with the deposition system.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
