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Chromium-Aluminum Alloy Sputtering Target (CrAl)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Deposition parameters must be maintained within specified power density and pressure ranges to achieve stoichiometric transfer and thickness uniformity. Bonding type and backing plate material must be selected to match the sputtering system's cooling and mounting requirements.
- Power Density Range: Apply DC power density between 3 and 15 W/cm² or RF power density between 1 and 5 W/cm² to prevent target cracking or arcing.
- Argon Working Pressure: Maintain argon working pressure between 0.5 and 2.0 Pa to sustain stable plasma discharge and control film morphology.
- Substrate Adhesion Requirement: Prepare substrates to achieve pull-off adhesion strength greater than 15 MPa per ASTM D4541 prior to deposition.
- Bonding Selection: Select indium or elastomer bonding based on thermal conductivity requirements and system compatibility.
- Backing Plate Material: Use oxygen-free copper or CuCrZr backing plate to ensure adequate heat dissipation during high-power sputtering.
What are the recommended sputtering parameters and achievable deposition rates for the CrAl alloy target?
The CrAl target is optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa argon atmosphere, yielding deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate. The alloy composition transfers within ±2 at% under optimized conditions.
What bonding and backing plate options are available for the CrAl sputtering target?
Bonding options include indium bonding or elastomer bonding, and backing plate choices are oxygen-free copper or CuCrZr. These options allow adaptation to different sputtering system requirements, but should be confirmed against the deposition system before ordering.
What impurity levels and film adhesion quality can be expected from the 99.99% purity CrAl target?
The target offers 99.99% (4N) purity with total metallic impurities below 100 ppm and oxygen/nitrogen below 20 ppm, minimizing contamination. Deposited films achieve adhesion strength greater than 15 MPa per ASTM D4541 pull-off testing on properly prepared substrates. The target also exhibits relative density ≥95% and fine grain size ≤50 µm for consistent sputtering behavior.
The CrAl sputtering target (99.99% purity, 3" diameter x 0.25" thick) offers high-purity deposition with controlled stoichiometry and optimized sputtering parameters for uniform thin films, but requires careful matching of bonding and backing plate to the deposition system.
Positive
- High purity with low impurity levels: 99.99% purity with total metallic impurities <100 ppm and O+N <20 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Controlled deposition rate and uniformity: Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rate with ±5% thickness uniformity across 100 mm substrate.
Trade-offs
- Bonding and backing plate compatibility: Supply options include indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate; selection must match the thermal and mechanical requirements of the deposition system to avoid failure.
- Sensitivity to sputtering conditions: Stoichiometric transfer is within ±2 at% only under optimized conditions; deviations in power density, pressure, or substrate preparation can affect film composition and adhesion.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
