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Cobalt-Iron Alloy Sputtering Target (CoTbFe)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires operation under high vacuum with controlled argon atmosphere and power density to achieve stoichiometric film transfer. Bonding and backing plate selection must be compatible with the deposition system's cooling and mounting specifications to prevent thermal damage and ensure adhesion.
- Vacuum and Atmosphere Requirements: Deposition must be performed under vacuum with argon gas at a pressure between 0.5 and 2.0 Pa to maintain stable plasma conditions.
- Power Density Limits: Apply DC power density between 3 and 15 W/cm² or RF power density between 1 and 5 W/cm² to avoid target cracking or excessive heating.
- Bonding and Backing Plate Selection: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate based on the sputtering system's thermal management and mounting interface.
- Substrate Preparation: Properly clean and prepare substrates to achieve deposited film adhesion strength greater than 15 MPa as per ASTM D4541.
- Film Uniformity Constraint: Maintain target-to-substrate distance and rotation to achieve thickness uniformity within ±5% across a 100 mm substrate.
What is the optimal power density range for DC and RF sputtering of the CoTbFe alloy target, and how does it affect deposition rate and stoichiometry?
For DC magnetron sputtering, the optimal power density range is 3-15 W/cm², and for RF sputtering, 1-5 W/cm². Under these conditions in a 0.5-2.0 Pa Ar atmosphere, deposition rates of 10-80 nm/min are achieved with stoichiometric transfer within ±2 at% of the nominal CoTbFe composition.
Is the CoTbFe sputtering target suitable for magneto-optical thin film deposition?
Yes, the CoTbFe alloy target is explicitly suitable for magnetic, magneto-optical, and hydrogen-storage thin films. Deposited films from this target exhibit adhesion strength greater than 15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
What bonding and backing plate configurations are available for the CoTbFe target, and how do they impact thermal management during sputtering?
The target is available with indium bonding or elastomer bonding (optional) and can be mounted on an oxygen-free copper or CuCrZr backing plate (optional). These options allow optimization of thermal conductivity to the sputter cathode, which is critical for maintaining target integrity at power densities up to 15 W/cm² (DC).
This CoTbFe alloy sputtering target provides 99.9% purity and fine-grained microstructure (≤50 µm) for controlled thin film deposition via DC/RF magnetron sputtering, with deposition rates of 10-80 nm/min and thickness uniformity ±5% across 100 mm substrates, suitable for magnetic, magneto-optical, and hydrogen-storage thin films.
Positive
- High purity and low impurity levels: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized sputtering parameters: Supports DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Bonding and backing plate options: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional, requiring additional specification and compatibility verification with the deposition system.
- Pre-order compatibility verification: Procurement check requires confirming target specifications (purity, dimensions, composition ratio, bonding) against the deposition system before ordering to avoid mismatch.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
