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Cobalt-Nickel Alloy Sputtering Target (CoNi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document outlines the processing and compatibility constraints for the CoNi sputtering target. Adherence to these parameters is required to achieve specified film properties and avoid target damage.
- Sputtering Power Density Range: Deposit using DC magnetron sputtering at 3-15 W/cm² or RF sputtering at 1-5 W/cm² to maintain target integrity and deposition rate.
- Argon Atmosphere Pressure: Maintain argon pressure within 0.5-2.0 Pa during sputtering to achieve the specified deposition rate and thickness uniformity.
- Substrate Preparation Requirement: Properly prepare substrates to achieve deposited film adhesion strength greater than 15 MPa as per ASTM D4541 pull-off test.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate based on system compatibility and thermal management requirements.
- Purity and Contamination Control: Ensure total metallic impurities remain below 1000 ppm and oxygen plus nitrogen below 200 ppm to minimize film contamination.
What is the recommended power density range for DC and RF magnetron sputtering of the CoNi alloy target?
For DC sputtering, the recommended power density range is 3-15 W/cm², while for RF sputtering it is 1-5 W/cm². Under these conditions and an Ar atmosphere of 0.5-2.0 Pa, deposition rates of 10-80 nm/min can be achieved with ±5% thickness uniformity across a 100 mm substrate.
What bonding and backing plate options are specified for the CoNi sputtering target?
The target offers optional bonding types: indium bonding or elastomer bonding. The backing plate can be either oxygen-free copper or CuCrZr (optional). The appropriate selection depends on the thermal management and mounting requirements of your specific deposition system.
What are the purity and density specifications of the CoNi sputtering target that influence film quality?
The target has a purity of 99.9% (3N) with total metallic impurities less than 1000 ppm and oxygen plus nitrogen less than 200 ppm. It also has a relative density ≥95% of theoretical and a fine grain size ≤ 50 µm. These specifications help minimize contamination and promote uniform erosion during sputtering.
This CoNi alloy sputtering target (99.9% purity, 2" diameter x 2 mm) offers fine-grained microstructure (≤50 µm) and high density (≥95%) for uniform deposition in DC/RF magnetron sputtering, with low impurity levels (<1000 ppm metals, <200 ppm O+N) to minimize film contamination. Optimal performance requires careful selection of bonding and backing plate options and proper substrate preparation to achieve specified adhesion strength >15 MPa.
Positive
- High Purity and Low Impurities: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Fine-Grained Microstructure: Grain size ≤50 µm and relative density ≥95% ensure uniform sputtering and reduced particle ejection, enhancing film quality and thickness uniformity (±5% across 100 mm substrate).
Trade-offs
- Bonding and Backing Plate Selection: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional but must be selected based on thermal management needs; improper selection may lead to target cracking or poor heat dissipation during high-power sputtering.
- Substrate Preparation Dependency: Adhesion strength >15 MPa (ASTM D4541 pull-off) requires properly prepared substrates; inadequate cleaning or surface treatment can compromise coating performance.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
