CoCrFeAl Alloy Sputtering Target 2 in x 2 mm 99.9% ATOMFAIR®

$355.00

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Research-grade CoCrFeAl alloy sputtering target, 99.9% purity, 2 in x 2 mm size, for DC/RF magnetron sputtering and vacuum coating. Order now.

Cobalt-Chromium-Iron-Aluminum Alloy Sputtering Target (CoCrFeAl)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
Product Overview

Cobalt-Chromium-Iron-Aluminum Alloy Sputtering Target (CoCrFeAl) combines the CoCrFeAl alloy composition with a source-listed purity of 99.9% and a target size of 2indiameterx 2 mm.

The target is supplied for vacuum coating workflows using magnetron sputtering, vacuum plating and related deposition methods. Confirm the selected composition, dimensions, substrate system and quantity for the intended coating process.

Performance Features
  • CoCrFeAl alloy with nominal composition per chemical formula, enabling stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions.
  • 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm, minimizing contamination and improving deposited film resistivity and adhesion.
  • Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
  • Suitable for magnetic recording media, wear-resistant and biomedical coatings, with deposited films exhibiting adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-MT-COCS
Material / Formula CoCrFeAl
Purity 99.9%
Target Size 2indiameterx 2 mm
Relative Density ≥95% of theoretical
Grain Size ≤ 50 µm (fine-grained)
Deposition Method DC / RF Magnetron Sputtering
Max Power Density 3-15 W/cm² (DC) / 1-5 W/cm² (RF)
Bonding Type Indium bonding / Elastomer bonding (optional)
Backing Plate Oxygen-free copper / CuCrZr (optional)
Surface Finish Machined, Ra ≤ 0.8 µm
Thickness Tolerance ± 0.1 mm
Manufacturing Method Vacuum induction melting / Casting
Product Category Metal alloy sputtering target
PROCUREMENT CHECK: Confirm target specifications — purity, dimensions, composition ratio and bonding requirements — against your deposition system before ordering.
INQUIRY NOTE: Include the model number, target dimensions, purity grade and required quantity when requesting a quotation.
LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This sputtering target requires precise control of power density and argon pressure to achieve stoichiometric film transfer and adhesion strength above 15 MPa. The target must be bonded to a compatible backing plate and installed in a magnetron sputtering system operating under vacuum conditions.

  • Power Density Constraints: Operate DC sputtering at 3-15 W/cm² or RF sputtering at 1-5 W/cm² to avoid target cracking or excessive heating.
  • Atmosphere Constraints: Maintain argon pressure between 0.5 and 2.0 Pa to ensure stable plasma and achieve deposition rates of 10-80 nm/min with ±5% thickness uniformity.
  • Bonding and Backing Plate Compatibility: Select indium or elastomer bonding with an oxygen-free copper or CuCrZr backing plate to ensure adequate thermal and electrical contact during sputtering.
  • Surface Finish and Dimensional Tolerances: The target surface must be machined to Ra ≤ 0.8 µm and thickness tolerance ±0.1 mm to maintain uniform erosion and film quality.

What are the typical deposition rate and thickness uniformity achievable with the Atomfair CoCrFeAl sputtering target under DC magnetron sputtering?

Under DC magnetron sputtering at 3–15 W/cm² and 0.5–2.0 Pa Ar atmosphere, deposition rates of 10–80 nm/min are achieved with ±5% thickness uniformity across a 100 mm substrate. These values assume optimized conditions for stoichiometric film transfer and are based on the target's ≥95% relative density and ≤50 µm grain size.

What bonding and backing plate configurations are available for the CoCrFeAl target to ensure compatibility with different sputtering systems?

The target offers optional indium bonding or elastomer bonding for thermal and mechanical interface, with backing plate choices of oxygen-free copper or CuCrZr. These options allow the user to match thermal conductivity and mechanical stiffness requirements of their specific sputtering system and power regime.

What adhesion strength can be expected from CoCrFeAl films deposited using this target, and what substrate preparation is required?

Deposited CoCrFeAl films exhibit adhesion strength greater than 15 MPa as measured by ASTM D4541 pull-off testing on properly prepared substrates. The product description does not specify substrate pre-treatment steps, but standard practices such as ion cleaning or applying an adhesion layer are typically needed to achieve the stated adhesion.

Cobalt-Chromium-Iron-Aluminum alloy sputtering target with 99.9% purity and fine grain size, optimized for DC/RF magnetron sputtering to produce uniform films with ±5% thickness uniformity across 100 mm substrates. Requires careful selection of bonding and backing plate options for thermal management.

Positive

  • High purity and fine grain microstructure: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm, combined with ≤50 µm grain size, minimizes contamination and promotes uniform erosion and consistent film properties.
  • Controlled deposition rates and uniformity: Achieves 10–80 nm/min deposition rates with ±5% thickness uniformity across a 100 mm substrate under specified DC/RF power and Ar pressure, suitable for precision coating applications.

Trade-offs

  • Requires matched sputtering infrastructure: Optimal use demands DC/RF magnetron sputtering with 0.5–2.0 Pa Ar atmosphere and power density limits (3–15 W/cm² DC, 1–5 W/cm² RF); deviations may reduce film quality or target life.
  • Bonding and backing plate selection critical: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plates are optional but essential for thermal dissipation; incorrect choice risks target delamination or cracking during high-power sputtering.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).