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Cobalt-Chromium-Aluminum-Yttrium Alloy Sputtering Target (CoCrAlY)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The target is intended for vacuum deposition only under controlled magnetron sputtering conditions. Operational parameters directly affect film stoichiometry, adhesion, and uniformity.
- Deposition environment: Maintain a 0.5-2.0 Pa argon atmosphere while sputtering to satisfy the target's optimized operating envelope.
- Power density limits: Apply DC power density of 3-15 W/cm² or RF power density of 1-5 W/cm² to preserve stoichiometric transfer and avoid target damage.
- Substrate preparation: Prepare substrates so that deposited films meet the stated pull-off adhesion strength exceeding 15 MPa.
- Mounting and bonding: Confirm indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate compatibility with the deposition system before installation.
Install the target into a vacuum deposition system, set the argon atmosphere, and apply controlled magnetron power. Confirm target specifications with the system before beginning the process.
Required Equipment: Magnetron sputtering system, DC or RF power supply, Argon gas supply
- Confirm target compatibility
Verify the target purity, dimensions, composition, and bonding type against the deposition system before mounting. - Mount the target
Mount the target using the specified indium or elastomer bonding method on the selected backing plate. - Set the argon atmosphere
Evacuate the chamber and introduce argon to a pressure between 0.5 and 2.0 Pa. - Apply sputtering power
Set the power supply to the specified DC or RF power density range for the target material.
What deposition rate and thickness uniformity can be achieved with the CoCrAlY sputtering target under DC magnetron sputtering conditions?
Under DC magnetron sputtering at 3–15 W/cm² and 0.5–2.0 Pa Ar, deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate are specified. Optimized parameters enable stoichiometric transfer within ±2 at%.
What purity levels and impurity limits are specified for the CoCrAlY sputtering target, and how do they affect film quality?
The target has 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm. This minimizes contamination to improve deposited film resistivity and adhesion, with adhesion strength >15 MPa per ASTM D4541 pull-off on properly prepared substrates.
What bonding and backing plate configurations are available for the CoCrAlY target to manage thermal load during sputtering?
The target offers optional indium bonding or elastomer bonding, and backing plate options of oxygen-free copper or CuCrZr. These configurations help manage heat dissipation and thermal stress during high-power sputtering, ensuring stable operation under DC or RF magnetron conditions.
The CoCrAlY sputtering target (99.95% purity, 3"x0.125") provides controlled stoichiometric transfer and low contamination for vacuum deposition, but requires careful selection of bonding and backing plate for optimal thermal management and compatibility with the sputtering system.
Positive
- High purity with low impurities: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized sputtering conditions: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Bonding and backing plate dependency: The target requires optional indium or elastomer bonding and an oxygen-free copper or CuCrZr backing plate, adding procurement complexity and potential thermal management constraints.
- Sputtering parameter sensitivity: Optimal film stoichiometry and uniformity are achieved only within a narrow power density and pressure window; deviations may increase compositional variation or reduce deposition quality.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
