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Cobalt-Chromium-Aluminum Alloy Sputtering Target (CoCrAl)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document outlines the processing and compatibility constraints for the CoCrAl sputtering target to ensure optimal film deposition and prevent target damage. Adherence to specified power density ranges, argon pressure, and substrate preparation is required for achieving stoichiometric transfer and adhesion strength.
- Sputtering Parameter Constraints: Operate the target within DC power density of 3-15 W/cm² or RF power density of 1-5 W/cm² under an argon atmosphere of 0.5-2.0 Pa to maintain stoichiometric transfer and prevent target cracking.
- Substrate Preparation Requirement: Prepare substrates with appropriate cleaning and surface activation to achieve deposited film adhesion strength exceeding 15 MPa per ASTM D4541 pull-off testing.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate based on thermal management and system compatibility requirements.
- Pre-Order Verification: Confirm target purity, dimensions, composition ratio, and bonding requirements against the deposition system specifications before placing an order.
- Handling and Storage: Store the target in a clean, dry environment to prevent surface contamination and oxidation that could degrade sputtering performance.
This procedure describes the installation and operation of the CoCrAl sputtering target in a magnetron sputtering system. Follow these steps to achieve uniform film deposition within the specified parameters.
Required Equipment: Magnetron sputtering system, Argon gas supply, Backing plate with selected bonding
- Inspect Target
Inspect the target surface for scratches, pits, or contamination before installation. - Mount Target
Mount the target onto the selected backing plate using the chosen bonding method (indium or elastomer). - Install Assembly
Install the target assembly into the magnetron sputtering chamber and secure all electrical connections. - Set Argon Pressure
Set the argon gas pressure to between 0.5 and 2.0 Pa as required for stable plasma operation. - Apply Power
Apply DC power density within 3-15 W/cm² or RF power density within 1-5 W/cm² to initiate sputtering. - Monitor Deposition
Monitor the deposition rate (10-80 nm/min) and film thickness uniformity across the substrate during the process. - Cool and Remove
Allow the target to cool completely before removing it from the chamber to avoid thermal shock.
What are the recommended power density ranges for DC and RF sputtering of the CoCrAl target?
For DC magnetron sputtering, the recommended power density is 3–15 W/cm², and for RF sputtering it is 1–5 W/cm², both under 0.5–2.0 Pa Ar atmosphere, achieving deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
What bonding and backing plate options are available for the CoCrAl sputtering target?
The CoCrAl target offers optional indium bonding or elastomer bonding, and optional backing plates made of oxygen-free copper or CuCrZr alloy, allowing customization for thermal management and system compatibility.
What are the dimensional tolerances and surface finish specifications of the CoCrAl sputtering target?
The target has a thickness tolerance of ±0.1 mm and a machined surface finish with Ra ≤ 0.8 µm, ensuring proper fit in sputtering guns and minimizing outgassing or arcing during deposition.
This CoCrAl sputtering target offers 99.95% purity with low interstitial impurities, enabling stoichiometric film deposition with adhesion >15 MPa and thickness uniformity ±5% across 100 mm substrates under optimized DC/RF magnetron sputtering conditions.
Positive
- High purity with low impurities: 99.95% purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized sputtering performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate and adhesion strength >15 MPa.
Trade-offs
- Requires specification confirmation: Purity, dimensions, composition ratio, and bonding requirements must be confirmed against the deposition system before ordering to ensure compatibility.
- Optional bonding and backing plate: Bonding type (indium or elastomer) and backing plate (oxygen-free copper or CuCrZr) are optional; incorrect selection may affect thermal management or system fit.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
