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Cobalt-Palladium Alloy Sputtering Target (CoPd)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Operational constraints for the CoPd alloy sputtering target are derived from the manufacturer-specified deposition parameters and system-integration checks. These conditions apply to the target as supplied and to its use in a compatible vacuum coating system.
- Power and atmosphere envelope: Operate DC sputtering at 3–15 W/cm² or RF sputtering at 1–5 W/cm² under an argon pressure of 0.5–2.0 Pa to stay within the target's specified deposition window.
- Substrate and adhesion requirement: Prepare substrates according to the coating process requirements before deposition to achieve the stated pull-off adhesion strength.
- System compatibility check: Confirm target dimensions, purity, composition ratio, bonding type, and backing plate against the deposition system before ordering or installation.
- Surface integrity: Protect the machined target surface from impact or abrasion to preserve the as-supplied surface finish and thickness tolerance.
This procedure describes mounting, atmosphere set-up, and sputter deposition using the CoPd alloy target. It is intended for trained vacuum-coating personnel operating a compatible magnetron sputtering system.
Required Equipment: Compatible magnetron sputtering system, Backing plate with indium or elastomer bonding interface, Substrate holder
- Confirm system compatibility
Confirm that the CoPd target dimensions, purity grade, composition ratio, bonding type, and backing plate match the deposition system before mounting. - Mount the target
Mount the target onto the magnetron source using the specified backing plate and bonding interface, or install the pre-bonded configuration if supplied. - Set the process atmosphere
Evacuate the deposition chamber and backfill with argon to the specified 0.5–2.0 Pa operating pressure. - Ignite the plasma
Set the DC or RF power density within the rated range and ignite the plasma for sputtering. - Monitor deposition performance
Monitor the deposition rate and film thickness uniformity to confirm operation within the specified 10–80 nm/min and ±5% uniformity limits. - Complete the deposition run
Vent the chamber and remove the coated substrate only after the deposition process is complete.
What deposition rate and thickness uniformity can be achieved with the CoPd sputtering target under DC magnetron sputtering?
Under DC magnetron sputtering at 3–15 W/cm² and 0.5–2.0 Pa Ar atmosphere, the CoPd target yields deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate, as specified in the product’s performance features.
What bonding and backing plate options are available for this CoPd sputtering target and how do they affect compatibility with deposition systems?
The CoPd target is offered with indium bonding or elastomer bonding (optional), and backing plates of oxygen-free copper or CuCrZr (optional). These options allow the target to be adapted to different sputtering system mounting and cooling requirements, ensuring thermal management and mechanical fit.
What sputtering parameters are recommended for achieving stoichiometric film transfer with the CoPd alloy target?
For stoichiometric transfer within ±2 at%, the target should be operated in DC mode at 3–15 W/cm² or RF mode at 1–5 W/cm² under 0.5–2.0 Pa Ar. The fine-grained structure (≤50 µm) and high relative density (≥95%) support uniform erosion and consistent film composition under these conditions.
Cobalt-Palladium Alloy Sputtering Target (CoPd) with 99.99% purity and 1" x 0.125" size, optimized for DC/RF magnetron sputtering to produce stoichiometric films with controlled deposition rates and high adhesion strength, requiring careful selection of bonding and backing for system compatibility.
Positive
- High Purity with Low Contaminants: 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm minimizes film contamination, improving deposited film resistivity and adhesion.
- Controlled Deposition Performance: Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
Trade-offs
- Fixed Target Geometry: Supplied only as 1" diameter x 0.125" thick; larger or custom sizes may require alternate sourcing, limiting compatibility with systems requiring different dimensions.
- Application-Specific Bonding and Backing: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing must be specified and confirmed compatible with the deposition system before ordering, adding procurement verification steps.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
