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Cobalt-Chromium Alloy Sputtering Target (CoCr (50:50 wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires bonding to a compatible backing plate and operation within specified power density and pressure ranges to prevent thermal stress and ensure film uniformity. The target's fine-grained microstructure and high density demand careful handling to avoid surface contamination and mechanical damage.
- Dimension verification: Verify that the target dimensions (3 in diameter x 0.125 in thickness) and thickness tolerance (±0.1 mm) are compatible with the sputtering cathode assembly before installation.
- Bonding and backing plate selection: Select the appropriate bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) based on the thermal load and vacuum compatibility of the deposition system.
- Power density limits: Operate the target within the specified power density range of 3-15 W/cm² (DC) or 1-5 W/cm² (RF) to prevent overheating, cracking, or delamination.
- Atmosphere and pressure control: Maintain an argon atmosphere at 0.5-2.0 Pa during sputtering to achieve stable plasma and deposition rates of 10-80 nm/min with ±5% thickness uniformity.
- Substrate preparation for adhesion: Ensure the substrate surface is properly prepared to achieve adhesion strength >15 MPa as per ASTM D4541 pull-off test.
What is the significance of the 99.95% purity and fine grain size (≤50 µm) in CoCr sputtering targets for magnetic recording media applications?
The 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes film contamination, directly improving deposited film resistivity and adhesion. The fine grain size (≤50 µm) ensures uniform sputtering erosion and consistent film composition, which is critical for magnetic recording media where stoichiometric transfer and low defect density are required.
Which bonding type and backing plate material should be selected for high-power DC sputtering of this CoCr target?
For high-power DC sputtering, indium bonding is recommended for its high thermal conductivity to dissipate heat effectively, while elastomer bonding is an option for lower-temperature applications. The backing plate can be oxygen-free copper or CuCrZr; oxygen-free copper offers superior thermal conductivity, whereas CuCrZr provides higher mechanical strength for larger or heavier targets.
What are the recommended sputtering parameters (power density, pressure, deposition rate) for achieving stoichiometric CoCr films with good uniformity?
Optimal sputtering ranges are DC power density of 3–15 W/cm² or RF power density of 1–5 W/cm² under an Ar atmosphere of 0.5–2.0 Pa. Within these conditions, deposition rates of 10–80 nm/min are achievable with ±5% thickness uniformity across a 100 mm substrate, enabling stoichiometric transfer to within ±2 at% of the source composition.
The CoCr (50:50 wt%) sputtering target offers 99.95% purity and fine-grained microstructure for stoichiometric film deposition, but requires precise vacuum sputtering conditions and selection of bonding/backing plate for optimal performance.
Positive
- High purity with low impurities: 99.95% purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes film contamination, improving resistivity and adhesion in deposited coatings.
- Optimized sputtering performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Requires vacuum deposition system: The target is designed for vacuum coating methods such as magnetron sputtering; users must have compatible vacuum infrastructure and process control to achieve specified performance.
- Bonding and backing plate options: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional, requiring careful selection to match the deposition system's thermal and mechanical requirements.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
