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Aluminum-Scandium Alloy Sputtering Target (AlSc)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The AlSc sputtering target requires strict control of sputtering parameters and substrate preparation to achieve specified film properties. Operating outside the recommended power density, pressure, or bonding conditions may degrade film quality or target lifetime.
- Sputtering parameter limits: The target must be operated within DC power density of 3–15 W/cm² or RF power density of 1–5 W/cm² under an argon atmosphere of 0.5–2.0 Pa to maintain stoichiometric transfer.
- Deposition rate and uniformity constraint: Deposition rate is limited to 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate under optimized conditions.
- Microstructural and density requirements: The target must have a relative density of at least 93% of theoretical and a grain size not exceeding 50 μm to minimize particle generation and ensure consistent sputter behavior.
- Surface finish and bonding compatibility: The target surface finish must be Ra ≤ 0.8 μm, and the bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) must match the deposition system's thermal and mechanical requirements.
- Film adhesion prerequisite: Deposited films achieve adhesion strength >15 MPa (ASTM D4541 pull-off) only on properly prepared substrates, requiring pre-cleaning and surface activation protocols.
What deposition rates and thickness uniformity can be achieved with the AlSc sputtering target under DC magnetron sputtering conditions?
This AlSc target achieves deposition rates of 10–80 nm/min under DC magnetron sputtering at 3–15 W/cm² in 0.5–2.0 Pa Ar atmosphere, with ±5% thickness uniformity across a 100 mm substrate. Stoichiometric transfer is maintained within ±2 at% under optimized sputtering conditions.
What bonding and backing plate configurations are available for thermal management during high-power sputtering with the AlSc target?
The target is offered with indium bonding or elastomer bonding options, and backing plates made of oxygen-free copper or CuCrZr. These choices allow thermal conductivity optimization, supporting DC power densities up to 15 W/cm² without exceeding thermal limits.
How does the 99.9% purity and fine grain size of the AlSc target affect film quality in sensitive thin-film applications?
The 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination in deposited films. The fine-grained structure (≤50 µm) ensures uniform erosion and consistent stoichiometry, contributing to adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
The AlSc sputtering target (6 in diameter, 0.125 in thick, 99.9% purity) delivers fine-grained microstructure (≤50 µm) and high density (≥93%), enabling stoichiometric film transfer with ±2 at% composition control under optimized DC/RF magnetron sputtering. Its low metallic impurity profile (<1000 ppm) and controlled O+N content (<200 ppm) support high-quality deposition for magnetic and hydrogen-storage thin films, but the target's specific bonding options and size require verification against the user's sputtering system.
Positive
- High purity 99.9% with low impurities: Total metallic impurities <1000 ppm and O+N <200 ppm minimize film contamination, improving resistivity and adhesion for precision thin-film applications.
- Optimized deposition performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Infrastructure and bonding requirements: The target requires specific sputtering conditions (Ar atmosphere, power density range) and optional indium or elastomer bonding, necessitating compatible mounting hardware and process tuning.
- System compatibility verification needed: The 6 in diameter x 0.125 in size and bonding options must be confirmed against the deposition system's target holder and cooling capacity before ordering to avoid fitment issues.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
