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Aluminum-Vanadium Alloy Sputtering Target (AlV)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires precise control of deposition parameters within specified power density and pressure ranges to achieve stoichiometric transfer and adhesion. Bonding type and backing plate must be selected based on the deposition system's thermal and mechanical requirements to prevent target damage.
- Power Density Constraint: DC power density must be limited to the range of 3–15 W/cm² to prevent target thermal stress and ensure stoichiometric film transfer.
- Chamber Pressure Constraint: Argon working pressure must be maintained between 0.5 and 2.0 Pa to sustain a stable magnetron plasma and achieve uniform deposition.
- Bonding and Backing Plate Requirement: Indium or elastomer bonding must be selected based on deposition temperature and thermal cycling to maintain thermal contact and avoid target cracking.
- Substrate Preparation Requirement: Substrates must be cleaned and prepared according to ASTM D4541 to achieve deposited film adhesion exceeding 15 MPa.
- Deposition Uniformity Requirement: Deposition parameters must be optimized to maintain thickness uniformity within ±5% across a 100 mm substrate as specified.
What is the typical deposition rate and thickness uniformity achievable when sputtering the AlV alloy target under specified DC/RF conditions?
Under DC power density of 3-15 W/cm² or RF power density of 1-5 W/cm² in a 0.5-2.0 Pa argon atmosphere, the AlV sputtering target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
What bonding and backing plate options are available for the AlV sputtering target to ensure thermal management and compatibility with different magnetron sputtering systems?
The AlV target offers optional indium bonding or elastomer bonding for thermal and mechanical interface, with backing plate options of oxygen-free copper or CuCrZr. These choices accommodate system-specific cooling and mounting requirements.
What are the relative density and grain size specifications of the AlV sputtering target, and why are they critical for sputtering performance?
The target has a relative density ≥95% of theoretical and a fine grain size ≤50 µm. High density minimizes arcing and particle generation, while fine grain size promotes uniform erosion and consistent film properties during deposition.
The AlV alloy sputtering target (99.95% purity, 2 in diameter × 0.25 in) is evaluated for DC/RF magnetron sputtering, offering stoichiometric transfer within ±2 at% and deposition rates of 10–80 nm/min with ±5% thickness uniformity on 100 mm substrates, suitable for interconnect and barrier layer applications.
Positive
- High purity with low contamination: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes film contamination, improving deposited film resistivity and adhesion for critical thin-film applications.
- Controlled microstructure for uniform deposition: Fine grain size ≤50 µm and relative density ≥95% of theoretical support consistent sputtering behavior and ±5% thickness uniformity across 100 mm substrates under optimized conditions.
Trade-offs
- Bonding and backing plate options require confirmation: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plates are optional; the buyer must specify and confirm compatibility with their deposition system before ordering to avoid thermal or mechanical mismatch.
- Narrow operating window for optimal performance: Optimal sputtering conditions are confined to 3–15 W/cm² (DC) or 1–5 W/cm² (RF) under 0.5–2.0 Pa Ar atmosphere; deviations may reduce deposition rate or film uniformity, requiring precise process control.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
