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Aluminum-Tungsten Alloy Sputtering Target (AlW)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The AlW sputtering target requires specific bonding, mounting, and sputtering parameters to maintain film quality and equipment compatibility. Deposition conditions must be controlled within the stated power density, pressure, and substrate preparation ranges to achieve the specified adhesion and uniformity.
- Bonding and Mounting Constraints: Select indium or elastomer bonding and an oxygen-free copper or CuCrZr backing plate based on the system's cooling capacity and power density to prevent delamination during sputtering.
- Power Density Limits: Do not exceed 15 W/cm² for DC or 5 W/cm² for RF sputtering to avoid target cracking or debonding.
- Atmosphere and Pressure: Maintain an argon atmosphere between 0.5 and 2.0 Pa to achieve the specified deposition rate of 10-80 nm/min and thickness uniformity of ±5% across a 100 mm substrate.
- Substrate Preparation: Prepare substrates to achieve an adhesion strength greater than 15 MPa per ASTM D4541 pull-off test to ensure deposited film integrity.
What is the optimum DC power density range for sputtering an AlW alloy target to maintain stoichiometric film composition?
The recommended DC power density range is 3-15 W/cm². Under optimized sputtering conditions within this range, the AlW target achieves stoichiometric transfer to deposited films within ±2 at%. The corresponding deposition rate is 10-80 nm/min, with ±5% thickness uniformity across a 100 mm substrate.
Which bonding type and backing plate material are available for the AlW sputtering target, and how do they affect thermal management under high-power sputtering?
The target offers optional indium bonding or elastomer bonding, and optional oxygen-free copper or CuCrZr backing plates. Indium bonding provides superior thermal conductivity for dissipating heat generated at maximum power densities of 15 W/cm² (DC) or 5 W/cm² (RF), while elastomer bonding is suitable for lower-temperature processes.
What substrate size can achieve the specified ±5% thickness uniformity with the 2-inch diameter AlW sputtering target?
Under the specified sputtering conditions (DC 3-15 W/cm² or RF 1-5 W/cm², Ar atmosphere 0.5-2.0 Pa), the AlW target can achieve ±5% thickness uniformity across a 100 mm substrate. The target diameter is 2 inches (50.8 mm), which is compatible with many standard sputter systems.
The AlW sputtering target (99.95% purity, 2 in diameter x 0.25 in thick) is engineered for DC/RF magnetron sputtering with a fine-grained microstructure and high relative density, enabling controlled deposition rates of 10–80 nm/min and ±5% thickness uniformity. Users must specify bonding type and backing plate material, and verify compatibility with their deposition system prior to ordering.
Positive
- High purity and density: 99.95% purity with <500 ppm total metallic impurities and <100 ppm O+N, combined with ≥95% theoretical density and ≤50 µm grain size, minimizes contamination and promotes consistent film adhesion and resistivity.
- Optimized sputtering parameters: Specified DC (3–15 W/cm²) and RF (1–5 W/cm²) power densities, 0.5–2.0 Pa Ar atmosphere, and deposition rates of 10–80 nm/min with ±5% uniformity across 100 mm substrates enable reproducible thin-film deposition.
Trade-offs
- Bonding and backing plate selection: Target requires a bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) to be specified; improper selection may affect thermal conductivity and sputter compatibility.
- System compatibility verification needed: The procurement check explicitly requires confirming target dimensions, purity, composition ratio, and bonding requirements against the deposition system before ordering, placing the responsibility on the buyer to ensure fit.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
