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Aluminum-Chromium Alloy Sputtering Target (AlCr)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document outlines critical constraints for the Aluminum-Chromium alloy sputtering target during use in magnetron sputtering systems. Adherence to these specifications ensures film stoichiometry, adhesion, and target longevity.
- Power Density and Atmosphere: Operate DC magnetron sputtering at 3-15 W/cm² or RF at 1-5 W/cm² under an Ar atmosphere of 0.5-2.0 Pa to avoid target cracking and maintain deposition rate of 10-80 nm/min.
- Bonding and Backing Plate: The target must be bonded to a backing plate of oxygen-free copper or CuCrZr using indium or elastomer bonding to ensure thermal management during sputtering.
- Substrate Preparation: Achieve adhesion strength >15 MPa only on properly prepared substrates; verify substrate cleanliness and surface activation before deposition.
- Target Handling: Maintain the machined surface finish of Ra ≤0.8 µm and avoid contamination to prevent particle generation during sputtering.
- Deposition Uniformity: Thickness uniformity of ±5% across a 100 mm substrate requires precise target-to-substrate distance and plasma confinement.
What deposition rates and uniformity can be expected from the AlCr sputtering target under typical DC/RF magnetron conditions?
Under optimized conditions (DC: 3-15 W/cm², RF: 1-5 W/cm², 0.5-2.0 Pa Ar), the AlCr target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate. The stoichiometric transfer of AlCr is maintained within ±2 at% of the nominal composition under these parameters.
What bonding and backing plate options are available for the AlCr target, and how do they affect thermal management during sputtering?
The target supports indium bonding or elastomer bonding as optional bonding types, with backing plate options of oxygen-free copper or CuCrZr alloy. Indium bonding offers superior thermal conductivity for high-power DC sputtering, while elastomer bonding provides easier debonding and lower thermal stress. The choice directly impacts heat dissipation and target cooling efficiency, which is critical for maintaining stable deposition rates and preventing target cracking at power densities up to 15 W/cm² (DC).
What is the significance of the ≤50 µm grain size and ≥95% relative density for AlCr target performance?
The fine grain size (≤50 µm) and high relative density (≥95% of theoretical) minimize preferential sputtering and arc formation, promoting uniform erosion and consistent film composition over the target lifetime. These specifications also reduce gas entrapment and particulate generation, which is essential for producing low-defect, high-adhesion AlCr films in interconnect, barrier, and optical coating applications.
Atomfair's AlCr sputtering target (99.95% purity, ≤50 µm grain size) delivers consistent film stoichiometry within ±2 at% for interconnect and barrier layer applications, but requires careful matching of DC/RF power and Ar pressure to maintain ±5% thickness uniformity.
Positive
- High Purity and Low Impurities: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm, minimizing contamination in deposited films and improving resistivity and adhesion.
- Optimized Sputtering Performance: Fine grain size ≤50 µm and relative density ≥95% of theoretical enable stable sputtering rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates under specified DC/RF conditions.
Trade-offs
- Fixed Target Dimensions: Supplied as 2 inch diameter x 0.25 inch thickness only; buyers must confirm compatibility with their deposition system's target holder and sputter gun geometry.
- Process Parameter Sensitivity: Optimal deposition rates of 10-80 nm/min are achieved only within a narrow window of 3-15 W/cm² (DC) or 1-5 W/cm² (RF) at 0.5-2.0 Pa Ar; deviations may degrade film uniformity or stoichiometry.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
