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Aluminum Alloy Sputtering Target (AlYb)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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AlYb sputtering target requires processing within specified power density and pressure regimes to achieve stoichiometric film transfer. Proper substrate preparation and bonding selection are critical to meet adhesion and uniformity targets.
- Power Density Constraint: Apply DC power between 3 and 15 W/cm² or RF power between 1 and 5 W/cm² to avoid target damage.
- Pressure Requirement: Maintain argon atmosphere at 0.5-2.0 Pa during deposition to ensure stable plasma conditions.
- Substrate Preparation: Clean and prepare substrates to achieve adhesion strength greater than 15 MPa per ASTM D4541.
- Bonding and Backing Plate Selection: Select indium or elastomer bonding and copper or CuCrZr backing plate compatible with the sputtering system's cooling and mounting interface.
- Compatibility Verification: Confirm target purity, dimensions, composition ratio, and bonding type against the deposition system before installation.
What sputtering parameters achieve stoichiometric transfer and uniform deposition with an AlYb alloy target?
Optimized DC or RF magnetron sputtering at 3–15 W/cm² (DC) or 1–5 W/cm² (RF) under 0.5–2.0 Pa Ar atmosphere yields stoichiometric transfer within ±2 at% and deposition rates of 10–80 nm/min. Film thickness uniformity is ±5% across a 100 mm substrate, ensuring consistent film properties.
What bonding and backing plate options are available for the AlYb sputtering target, and how do they affect thermal management?
The target offers optional indium bonding or elastomer bonding to the backing plate, with backing plate choices of oxygen-free copper or CuCrZr. Indium bonding provides superior thermal conductivity for high-power DC sputtering, while elastomer bonding simplifies mounting and reduces risk of target cracking during thermal cycling.
How do purity and microstructure specifications impact film quality in AlYb sputtering targets?
The 99.95% purity (3N5) with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination, improving deposited film resistivity and adhesion. A fine grain size ≤50 µm and relative density ≥93% of theoretical contribute to uniform erosion and consistent film stoichiometry during sputtering.
The AlYb sputtering target (99.95% purity, 2 in diameter x 0.25 in) is engineered for DC/RF magnetron sputtering of magnetic, magneto-optical, and hydrogen-storage thin films, offering high purity and controlled grain size for consistent film quality, but requires careful selection of bonding and backing plate options and optimization of deposition parameters per system.
Positive
- High purity with low impurity levels: 99.95% purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination in deposited films, improving resistivity and adhesion.
- Optimized for DC/RF magnetron sputtering: Operates at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
Trade-offs
- Requires system-specific bonding and backing plate selection: Bonding type (Indium or Elastomer) and backing plate material (oxygen-free copper or CuCrZr) must be selected to match the deposition system's thermal and mechanical requirements.
- Sputtering parameters must be optimized per system: The recommended power density and pressure ranges are guidelines; actual deposition conditions must be optimized for the specific system, target size, and substrate to achieve target stoichiometry and uniformity.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
