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Aluminum-Titanium Alloy Sputtering Target (AlTi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires operation within specified power density and argon pressure ranges to achieve optimal film stoichiometry and thickness uniformity. Proper bonding to a compatible backing plate and surface cleanliness are critical to prevent contamination and ensure adhesion strength greater than 15 MPa.
- Power Density Limits: Operate DC sputtering at 3-15 W/cm² or RF sputtering at 1-5 W/cm² to avoid target cracking or excessive heating.
- Argon Pressure Range: Maintain Ar atmosphere between 0.5-2.0 Pa to sustain stable plasma and achieve deposition rates of 10-80 nm/min with ±5% thickness uniformity.
- Bonding Requirement: Select indium or elastomer bonding to ensure adequate thermal contact and mechanical stability during sputtering operations.
- Backing Plate Material: Use oxygen-free copper or CuCrZr backing plate to effectively dissipate heat and prevent target deformation under high power density.
- Surface Finish Constraint: Maintain a machined surface finish with Ra ≤ 0.8 µm to minimize particle generation and arcing during deposition.
What is the expected composition tolerance of the AlTi film deposited from this sputtering target?
Under optimized sputtering conditions, the AlTi target enables stoichiometric transfer within ±2 at% of the nominal composition. This tolerance is achieved by controlling power density, argon pressure, and substrate temperature per the target's specified operating window.
What are the recommended power density ranges for DC and RF magnetron sputtering of this AlTi alloy target?
The target is optimized for DC sputtering at 3–15 W/cm² and RF sputtering at 1–5 W/cm² under 0.5–2.0 Pa Ar atmosphere. Operating within these ranges yields deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
Which bonding and backing plate options are available for the AlTi sputtering target, and how do they affect its use?
The target can be supplied with either indium bonding or elastomer bonding, and with an oxygen-free copper or CuCrZr backing plate. Indium bonding on CuCrZr is typically selected for high-power density applications due to superior thermal conductivity, while elastomer bonding offers easier target exchange. The choice must be confirmed against the deposition system's cooling and mounting requirements.
The AlTi sputtering target (99.99% purity, 5" diameter x 15 mm) offers high-purity deposition with controlled grain size and density, but requires careful specification of bonding and backing plate options and system compatibility verification prior to order.
Positive
- 99.99% Purity with Low Impurities: Total metallic impurities <100 ppm and O+N <20 ppm minimize contamination, improving deposited film resistivity and adhesion.
- Fine Grain Size and High Density: Grain size ≤50 µm and relative density ≥95% of theoretical promote uniform sputtering and consistent film properties across the target surface.
Trade-offs
- Mandatory Compatibility Verification: Procurement checklist requires confirming target specifications (purity, dimensions, composition, bonding) against the deposition system before ordering to avoid mismatch.
- Optional Bonding and Backing Plate: Bonding (indium or elastomer) and backing plate (oxygen-free copper or CuCrZr) are optional but must be specified; default configuration may not be suitable for all systems.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
