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Aluminum Alloy Sputtering Target (AlSm)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This target requires vacuum deposition infrastructure and controlled sputtering parameters for optimal film quality. Argon atmosphere at 0.5-2.0 Pa and power densities of 3-15 W/cm² (DC) or 1-5 W/cm² (RF) must be maintained during processing.
- Power Density Limits: Operate DC sputtering within 3-15 W/cm² and RF within 1-5 W/cm² to prevent target damage.
- Atmosphere Requirements: Maintain argon pressure between 0.5 and 2.0 Pa during deposition.
- Bonding Compatibility: Select indium or elastomer bonding based on thermal dissipation needs and system compatibility.
- Substrate Preparation: Prepare substrates thoroughly to achieve deposited film adhesion exceeding 15 MPa per ASTM D4541.
What are the trade-offs between DC and RF sputtering modes for the AlSm alloy target?
For the AlSm alloy sputtering target, DC magnetron sputtering supports a power density range of 3-15 W/cm², enabling higher deposition rates, while RF sputtering operates at 1-5 W/cm², which is suitable for non-conductive substrates or to mitigate charging effects. Both modes are conducted under 0.5-2.0 Pa Ar atmosphere and achieve deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
Which thin-film applications is the AlSm sputtering target suitable for, and what substrate preparation is required?
The AlSm target is designed for depositing magnetic, magneto-optical, and hydrogen-storage thin films. To achieve the stated adhesion strength >15 MPa (ASTM D4541 pull-off), substrates must be properly prepared, and the target's composition transfers with stoichiometry within ±2 at% under optimized sputtering conditions.
What bonding and backing plate options are available for the AlSm sputtering target, and how do they affect installation?
The AlSm sputtering target can be supplied with indium bonding or elastomer bonding, and with an oxygen-free copper or CuCrZr backing plate, both optional. The choice of bonding and backing plate material affects thermal management and compatibility with the sputtering system's cathode assembly, so it should be confirmed before ordering.
The AlSm sputtering target offers 99.9% purity with controlled metallic and gaseous impurities, enabling stoichiometric film deposition with adhesion >15 MPa, but requires careful selection of bonding and backing plate options to match the sputtering system.
Positive
- High purity and controlled impurities: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm reduces contamination, improving deposited film resistivity and adhesion.
- Optimized deposition rate and uniformity: Achieves 10-80 nm/min deposition rate with ±5% thickness uniformity across 100 mm substrate under recommended DC/RF conditions.
Trade-offs
- Bonding and backing plate options: Target requires selection of indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate, which must be compatible with the user's sputtering system.
- Pre-procurement compatibility check needed: Users must confirm target dimensions, purity, composition ratio, and bonding requirements against their deposition system before ordering to ensure proper fit and performance.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
