Thermal Conductive Copper Foam 60-98% Porosity ATOMFAIR®

COPPER FOAM 60-98% POROSITY THERMAL CONDUCTIVE EMI SHIELDING ELECTRODE

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features 60-98% porosity, 5-130PPI, ≥98% through-hole rate, and excellent thermal conductivity (>6W/(m²·K)). With superior electrical conductivity and mechanical strength (≥2.5MPa), it is widely used for LED/CPU cooling, battery electrodes, EMI shielding, filtration and catalysis. Custom sizes available.

Copper Foam Performance Parameters

Parameter	Specification
Heat Transfer Coefficient	>6 W/(m²·K)
Mechanical Strength	≥2.5 MPa
Tensile Strength	5–18 KPa
Pore Size	0.1–10 mm
Porosity	60–98%
Through-hole Rate	≥98%
Bulk Density	0.5–1.5 g/cm³
PPI (Pores Per Inch)	5–130 PPI

Application Directions

Heat dissipation materials, heat absorption materials, chemical catalyst carriers, electromagnetic shielding materials, filter materials, damping materials, battery electrode materials, sound-absorbing materials, decorative materials.

Thermal Dissipation Material Application

With the rapid development of electronic products, heat dissipation issues have gained increasing attention, especially for high-power LED lighting and CPU cooling, which have become key challenges for the industry. Small vapor chambers and heat pipe systems made from copper foam can effectively balance cost, volume and cooling efficiency, making them a key research direction in the high-power LED thermal management field. Once thermal issues are resolved, LEDs will see broader application in public lighting, harsh environment lighting and other scenarios.

Main Features

Copper foam has excellent thermal conductivity and can be widely used for heat conduction and dissipation in motors, electrical appliances and various electronic components.
Copper foam has superior electrical conductivity, and its application as electrode material in nickel-zinc batteries and electric double-layer capacitors is gaining significant industry attention.
Thanks to its unique structural characteristics and good biocompatibility, copper foam is also an outstanding filtration and water purification filter material.

Application Areas

Electrode Materials: The excellent electrical conductivity allows copper foam to be widely used as skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been trialed and put into batch use by several nickel-zinc battery manufacturers. It is also expected to achieve large-scale promotion as a current collector for electric double-layer capacitor electrodes, with broad prospects in electrolytic recovery of copper-containing wastewater.
Catalysts: In many organic chemical reactions, copper foam with large specific surface area can replace punched copper plates as chemical reaction catalysts. Copper foam as a carrier for photocatalytic air purification has achieved mature application.
Thermal Conduction Materials: Copper foam has outstanding thermal conductivity, making it an excellent flame-retardant material suitable for various high-end fire-fighting equipment, especially effective in flame isolation. Additionally, leveraging its excellent thermal conductivity and apparent permeability, copper foam can be used to manufacture heat dissipation components for motors and electrical appliances.
Sound Absorption and Shielding Materials: Sound waves undergo diffuse reflection on the copper foam surface, achieving noise reduction through expansion silencing and micro-pore sound absorption principles. The electromagnetic shielding performance of copper is close to silver, making copper foam an excellent EMI shielding material.
Filter Materials: With excellent structural properties and good biocompatibility, copper foam has been successfully applied as filter material and shows promising prospects in water purification equipment.
Fluid Pressure Buffering Materials: Copper foam provides dispersion and buffering effects on fluids, serving as an effective pressure reduction protection device for various pressure instruments.

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

What is the heat transfer coefficient of copper foam and how does it support thermal dissipation in LED and CPU cooling applications?

Copper foam has a heat transfer coefficient greater than 6 W/(m²·K), enabling efficient thermal conduction. It is used in small vapor chambers and heat pipe systems for high-power LED and CPU cooling, balancing cost, volume, and cooling efficiency.

Can copper foam be used as an electrode material for nickel-zinc batteries and electric double-layer capacitors?

Yes, copper foam is utilized as a skeletal electrode material for nickel-zinc batteries and electric double-layer capacitors due to its excellent electrical conductivity. It has been trialed and put into batch use by several nickel-zinc battery manufacturers and shows promise as a current collector for electric double-layer capacitor electrodes.

What standard sizes are available for copper foam and can it be customized to specific dimensions?

Standard sizes include 100mm×100mm×10mm, 200mm×300mm×2mm, and 300mm×300mm×5mm. Custom sizes are available upon request; contact inquiry@atomfair.com for customization requirements.

Assessment

Atomfair's variable copper foam product, available in 100×100×10 mm, 200×300×2 mm, and 300×300×5 mm sizes, combines 60–98% porosity with a ≥98% through-hole rate and a heat transfer coefficient above 6 W/(m²·K), making it technically relevant for thermal management, electrode, catalysis, filtration, and EMI shielding applications. The material's low tensile strength of 5–18 KPa and grade-dependent porous structure require careful handling and explicit specification of the desired pore geometry.

Positive

High through-hole porosity and thermal transport: With 60–98% porosity, ≥98% through-hole rate, and a heat transfer coefficient above 6 W/(m²·K), the foam is structurally suited for LED/CPU thermal management, heat pipe systems, and vapor chamber development.
Electrically conductive electrode and shielding material: The combination of high electrical conductivity, mechanical strength ≥2.5 MPa, and copper's near-silver electromagnetic shielding performance supports use as skeletal electrode material in nickel-zinc batteries, electric double-layer capacitors, and EMI shielding.

Trade-offs

Low tensile strength requires careful handling: Tensile strength is specified at only 5–18 KPa, so the porous structure is mechanically delicate in tension; handling, mounting, and integration must avoid concentrated pull or peel loading.
Performance depends on selected porous grade: Porosity spans 60–98% and PPI spans 5–130, meaning thermal, filtration, acoustic, and shielding behavior changes significantly with the chosen grade; buyers must specify the exact porous structure and rely on custom sizing for non-standard geometries.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).