COPPER FOAM 110PPI 0.3-25MM THICK THERMAL EMI FILTERADVANCED POROUS METAL MATERIAL
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TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official quotations.
EMAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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How does varying porosity affect the thermal and mechanical properties of copper foam for heat dissipation applications?
Copper foam porosity ranges from 60% to 98%; higher porosity increases surface area for heat transfer but reduces mechanical strength. The product guarantees a heat transfer coefficient greater than 6 W/(m²·K) and mechanical strength of at least 2.5 MPa, but specific performance depends on the chosen porosity and thickness. For optimal heat dissipation, a balance must be struck between high surface area and structural integrity.
Can copper foam be used as an electrode material for nickel-zinc batteries and what are its advantages?
Yes, copper foam is widely used as a skeletal electrode material for nickel-zinc batteries and electric double-layer capacitors due to its excellent electrical conductivity and high porosity. The source states it has been trialed and adopted by several nickel-zinc battery manufacturers. Its through-hole rate of ≥98% ensures efficient electrolyte flow, while the high electrical conductivity makes it suitable for current collector applications.
What are the dimensional customization options and tolerances for copper foam sheets?
The product is available in thicknesses from 0.2 to 80 mm with tolerances of ±0.05 to 1.0 mm, and length/width dimensions up to 500 mm with ±0.5 mm tolerance. Pore density ranges from 5 to 130 PPI (±5–10), and areal density from 280 to 3000 g/m² (±30–200). Custom sizes are available upon request; contact the engineering team at inquiry@atomfair.com for specific requirements.
This 110 PPI copper foam, offered in thicknesses from 0.3 to 25 mm and areal densities up to 3000 g/m², provides a high-porosity (60–98%) metallic scaffold with >98% through-hole rate, balancing thermal/electrical conductivity with mechanical compliance for electrode, shielding, and filtration roles.
Positive
- High porosity and through-hole rate: With 60–98% porosity and ≥98% through-hole rate, the foam enables efficient fluid flow, gas diffusion, and surface area utilization for filtration, catalytic, and battery electrode applications.
- Excellent thermal and electrical conductivity: Copper's intrinsic conductivity combined with the open-cell structure supports effective heat dissipation (>6 W/(m²·K) heat transfer coefficient) and use as a current collector or electrode skeleton in nickel-zinc batteries and supercapacitors.
Trade-offs
- Low tensile strength limits structural use: Tensile strength of 5–18 KPa is very low, meaning the foam cannot serve as a standalone load-bearing component and must be reinforced or supported in mechanical assemblies.
- Wide thickness tolerances for precision work: Thickness tolerance of ±0.05 to ±1.0 mm across the 0.2–80 mm range may require additional machining or selection for applications demanding tight dimensional control.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).






