Copper Foam 110 PPI 0.3-25 mm Thermal EMI ATOMFAIR®

Price range: $41.00 through $1,800.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Porous copper foam with 110 PPI pore density, 0.3-25 mm thickness range, ≥98% through-hole rate and 60%-98% porosity for electrodes and EMI filters. Order now.

COPPER FOAM 110PPI 0.3-25MM THICK THERMAL EMI FILTER

ADVANCED POROUS METAL MATERIAL

Copper Foam – Parameters & Description

Copper foam features high porosity and superior conductivity. With 110PPI pore density and 0.3-25mm thickness, it is ideal for battery electrodes, heat dissipation, electromagnetic shielding and filtration applications. Custom sizes available.

I. Basic Parameters

Parameter Specification
Thickness 0.3-25mm
Pore Density 110 PPI
Color Purple-red

II. Main Features

  • Copper foam exhibits excellent thermal conductivity and is widely used for heat conduction and dissipation in motors, electrical appliances, and electronic components.
  • Its outstanding electrical conductivity has drawn significant industry attention for applications as electrode materials in nickel-zinc batteries and electric double-layer capacitors.
  • Thanks to its excellent structural properties and good biocompatibility, copper foam serves as a high-quality filtration material suitable for water purification and filtration.

III. Application Areas

  • Electrode Materials: With excellent electrical conductivity, copper foam can be widely used as a skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been trialed and adopted in batch by several nickel-zinc battery manufacturers. It is also expected to be promoted as a current collector for electric double-layer capacitor electrodes. Furthermore, copper foam used as an electrode material for electrolytic recovery of copper-containing wastewater shows broad application prospects.
  • Acoustic and Electromagnetic Shielding Materials: Sound waves undergo diffuse reflection on the surface of copper foam, achieving noise reduction through expansion and micro-pore sound absorption mechanisms. The electromagnetic shielding performance of copper is close to that of silver, making copper foam an excellent electromagnetic shielding material.
  • Filter Materials: Copper foam offers excellent structural properties and biocompatibility. It has been successfully applied as a filter material and shows good application prospects in water purification devices.
  • Fluid Pressure Buffering Materials: Copper foam can disperse and buffer fluids, used as a pressure reduction protection device for various pressure instruments with excellent performance.

IV. Porous Copper Foam Technical Data

Parameter Specification
Heat Transfer Coefficient >6 W/(m²·K)
Mechanical Strength ≥2.5 MPa
Tensile Strength 5-18 KPa
Pore Size 0.1-10mm
Porosity 60%-98%
Through-hole Rate ≥98%
Bulk Density >0.1 g/cm³
PPI (Pores Per Inch) 5-130

V. Applications

Heat dissipation materials, heat absorption materials, chemical catalyst carriers, electromagnetic shielding materials, filter materials, damping materials, battery electrode materials, sound-absorbing materials, decorative materials

VI. Porous Metal Foam Basic Parameters

Parameter Specification
Density 0.15~0.45 g/cm³
Pore Density (PPI) 5~120 PPI
Thickness 0.5~25mm
Specification ≤500mm × 500mm

VII. Composition Indicators (ppm)

Element Cu Ni Fe S C Si
Indicator Matrix 0.5~5% ≤100 ≤80 ≤100 ≤50

VIII. Product Specifications & Technical Parameters

Item Parameter Range
Pore Count (PPI) 5~130 (±5~10)
Areal Density (g/m²) 280~3000 (±30~200)
Thickness (mm) 0.2~80 (±0.05~1.0)
Length / Width Dimensions (mm) 70 ≤ Length / Width ≤ 500 (±0.5)

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

How does varying porosity affect the thermal and mechanical properties of copper foam for heat dissipation applications?

Copper foam porosity ranges from 60% to 98%; higher porosity increases surface area for heat transfer but reduces mechanical strength. The product guarantees a heat transfer coefficient greater than 6 W/(m²·K) and mechanical strength of at least 2.5 MPa, but specific performance depends on the chosen porosity and thickness. For optimal heat dissipation, a balance must be struck between high surface area and structural integrity.

Can copper foam be used as an electrode material for nickel-zinc batteries and what are its advantages?

Yes, copper foam is widely used as a skeletal electrode material for nickel-zinc batteries and electric double-layer capacitors due to its excellent electrical conductivity and high porosity. The source states it has been trialed and adopted by several nickel-zinc battery manufacturers. Its through-hole rate of ≥98% ensures efficient electrolyte flow, while the high electrical conductivity makes it suitable for current collector applications.

What are the dimensional customization options and tolerances for copper foam sheets?

The product is available in thicknesses from 0.2 to 80 mm with tolerances of ±0.05 to 1.0 mm, and length/width dimensions up to 500 mm with ±0.5 mm tolerance. Pore density ranges from 5 to 130 PPI (±5–10), and areal density from 280 to 3000 g/m² (±30–200). Custom sizes are available upon request; contact the engineering team at inquiry@atomfair.com for specific requirements.

This 110 PPI copper foam, offered in thicknesses from 0.3 to 25 mm and areal densities up to 3000 g/m², provides a high-porosity (60–98%) metallic scaffold with >98% through-hole rate, balancing thermal/electrical conductivity with mechanical compliance for electrode, shielding, and filtration roles.

Positive

  • High porosity and through-hole rate: With 60–98% porosity and ≥98% through-hole rate, the foam enables efficient fluid flow, gas diffusion, and surface area utilization for filtration, catalytic, and battery electrode applications.
  • Excellent thermal and electrical conductivity: Copper's intrinsic conductivity combined with the open-cell structure supports effective heat dissipation (>6 W/(m²·K) heat transfer coefficient) and use as a current collector or electrode skeleton in nickel-zinc batteries and supercapacitors.

Trade-offs

  • Low tensile strength limits structural use: Tensile strength of 5–18 KPa is very low, meaning the foam cannot serve as a standalone load-bearing component and must be reinforced or supported in mechanical assemblies.
  • Wide thickness tolerances for precision work: Thickness tolerance of ±0.05 to ±1.0 mm across the 0.2–80 mm range may require additional machining or selection for applications demanding tight dimensional control.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

size

100mm*100mm*5mm, 400mm*500mm*2mm, 250mm*300mm*5mm, 500mm*500mm*10mm, 500mm*500mm*15mm, 500mm*500mm*20mm, 500mm*500mm*25mm