Copper Foam 0.1-10mm Pore ≥98% Through Porosity ATOMFAIR®

COPPER FOAM 0.1-10MM PORE ≥98% THROUGH POROSITY THERMAL EMI

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features high porosity and superior conductivity. With 0.1-10mm pore size, it is ideal for battery electrodes, heat dissipation, filtration and electromagnetic shielding. Custom sizes available.

I. Technical Parameters

Parameter	Specification
Pore Size	0.1mm–10mm
Porosity	60%–80%
Through-hole Rate	≥98%
Bulk Density	0.1–0.8 g/cm³
PPI (Pores Per Inch)	5–130
Tensile Strength	5–18 KPa
Compressive Strength	≥250 KPa
Mechanical Strength	2–5 MPa
Temperature Resistance	≥900°C
Heat Transfer Coefficient	>6 W/(m²·K)

II. Main Features

Copper foam exhibits excellent thermal conductivity and is widely used for heat conduction and dissipation in motors, electrical appliances, and electronic components.
Its outstanding electrical conductivity has drawn significant industry attention for applications in nickel-zinc batteries and electrode materials for electric double-layer capacitors.
Thanks to its unique structural characteristics and environmentally friendly, non-hazardous properties, copper foam also serves as a high-performance filtration and water purification material.

III. Application Areas

Electrode Materials: The excellent electrical conductivity makes copper foam suitable as a skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been adopted in volume by several nickel-zinc battery manufacturers. It can also be used as a current collector for electric double-layer capacitor electrodes and holds broad prospects in the electrolytic recovery of copper-containing wastewater.
Catalysts: In many organic chemical reactions, high-specific-surface-area copper foam can replace punched copper plates as a catalyst. It also works effectively as a carrier for photocatalytic air purification.
Thermal Conduction Materials: Its excellent thermal conductivity makes copper foam a highly efficient flame-retardant material, suitable for high-end fire-fighting equipment and flame isolation. It can also be used in heat-dissipating components for motors, electrical appliances, and other equipment.
Acoustic and Electromagnetic Shielding Materials: Sound waves undergo diffuse reflection on the surface of copper foam, achieving noise reduction through expansion and micro-pore sound absorption mechanisms. The electromagnetic shielding performance of copper is close to that of silver, making copper foam a high-quality electromagnetic shielding material.
Filter Materials: With outstanding structural properties and being human-friendly, copper foam can be used as a filter material and shows good application prospects in water purification devices.
Fluid Pressure Buffering Materials: It provides dispersion and buffering for fluids and can be used as a pressure reduction protection device for various pressure instruments.

Applications

Heat dissipation materials, heat absorption materials, chemical catalyst carriers, electromagnetic shielding materials, filter materials, damping materials, battery electrode materials, sound-absorbing materials, decorative materials

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

What is the trade-off between pore size and mechanical strength for Atomfair copper foam in battery electrode applications?

The copper foam offers a pore size range of 0.1–10 mm and a tensile strength of 5–18 KPa, with compressive strength ≥250 KPa and mechanical strength of 2–5 MPa. Larger pores reduce mechanical strength but increase electrolyte permeability, while smaller pores enhance surface area for active material loading at the cost of higher flow resistance. The 60–80% porosity and ≥98% through-hole rate ensure that even at the lower end of the pore size spectrum, ionic transport remains efficient for nickel-zinc battery and supercapacitor electrodes.

Can Atomfair copper foam be integrated directly as a current collector in electric double-layer capacitors without additional coating?

Yes, the copper foam's high electrical conductivity and ≥98% through-hole porosity make it suitable as a skeletal electrode material and current collector for electric double-layer capacitors. The bulk density of 0.1–0.8 g/cm³ and PPI range of 5–130 allow tailoring of the electrode structure for optimal capacitance and rate performance. No additional coating is required for the current collector function, though active material deposition on the foam surface is typical for full device assembly.

What are the handling and storage requirements for Atomfair copper foam to prevent oxidation before use?

Copper foam is susceptible to surface oxidation in ambient air, especially at elevated temperatures. The product should be stored in a dry, inert atmosphere or vacuum-sealed packaging to maintain its ≥98% through-hole porosity and electrical conductivity. For high-temperature applications up to ≥900°C, pre-treatment in a reducing atmosphere may be required to remove native oxide layers. Custom sizes are available, and the manufacturer recommends contacting the engineering team for specific handling protocols tailored to the intended application.

Assessment

This copper foam (Atomfair) features ≥98% through-hole porosity and high thermal conductivity, making it effective for electrode and heat dissipation applications, but its low tensile strength (5-18 KPa) requires careful handling and limits mechanical load-bearing use.

Positive

High through-hole porosity and specific surface area: With a through-hole rate ≥98% and porosity of 60-80%, this copper foam provides a large surface area per volume, enhancing mass transfer for catalytic reactions and electrode performance.
Excellent thermal conductivity and high temperature resistance: The foam's thermal conductivity >6 W/(m²·K) and temperature resistance up to 900°C enable effective heat dissipation in high-temperature environments, suitable for flame retardant and thermal management.

Trade-offs

Low tensile strength limits mechanical handling: The tensile strength ranges from 5 to 18 KPa, making the foam susceptible to tearing or deformation under tension, requiring careful handling during integration and limiting load-bearing applications.
Open-cell structure restricts fluid isolation: The ≥98% through-hole rate means the material is fully open-cell, which is unsuitable for applications requiring fluid containment or closed-cell insulation without additional sealing.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).