Copper Foam 50-98% Porosity ≥98% Through-Hole ATOMFAIR®

COPPER FOAM 50-98% POROSITY ≥98% THROUGH-HOLE THERMAL EMI FILTER

ADVANCED POROUS METAL MATERIAL

Copper Foam

Copper foam features high porosity (50%-98%), excellent thermal and electrical conductivity. With 0.1-10mm pore size (5-120ppi) and ≥98% through-hole rate, it is widely used for battery electrodes, heat dissipation, EMI shielding, filtration and catalysis. Custom sizes available.

I. Pore Characteristics and Bulk Density

Parameter	Specification
Pore Size	0.1mm-10mm (5-120ppi)
Porosity	50%-98%
Through-hole Rate	≥98%
Bulk Density	0.1-0.8 g/cm³

II. Main Features

Copper foam has excellent thermal conductivity and can be widely used for heat conduction and dissipation in motors, electrical appliances and electronic components.
Due to its superior electrical conductivity, copper foam is gaining industry attention for applications as electrode materials in nickel-zinc batteries and electric double-layer capacitors.
Thanks to its structural characteristics and human-friendly properties, copper foam is also an excellent filtration material and water purification filter medium.

III. Application Areas

Electrode Materials: The excellent electrical conductivity allows copper foam to be widely used as skeletal electrode material for new-type batteries such as nickel-zinc batteries and electric double-layer capacitors. It has been trialed and put into batch use by several nickel-zinc battery manufacturers. It is also expected to be promoted as a current collector for electric double-layer capacitor electrodes. Moreover, copper foam used as an electrode material for electrolytic recovery of copper-containing wastewater shows very broad prospects.
Catalysts: In many organic chemical reactions, people attempt to directly use copper foam with large specific surface area to replace punched copper plates as chemical reaction catalysts. Copper foam as a carrier for photocatalytic air purification has also been successfully applied.
Thermal Conduction Materials: Copper foam has excellent thermal conductivity, making it a superior flame-retardant material applied in many advanced fire-fighting equipment overseas, especially as a flame isolation device with outstanding effects. Additionally, using its excellent thermal conductivity and apparent permeability, copper foam is made into heat dissipation materials for motors and electrical appliances.
Sound Absorption and Shielding Materials: Sound waves undergo diffuse reflection on the surface of copper foam, achieving noise reduction through expansion silencing and micro-pore sound absorption principles. The shielding performance of copper is close to silver, making it an excellent electromagnetic shielding material.
Filter Materials: With excellent structural characteristics and human-friendly properties, copper foam metal products have been successfully applied as filter materials. Copper foam also shows good prospects in water purification device applications.
Fluid Pressure Buffering Materials: The dispersion and buffering effect of copper foam on fluids makes it an effective pressure reduction protection device for various pressure instruments.

Sizes can be customized. For any questions or specific customization requirements, please feel free to contact us at inquiry@atomfair.com

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

What is the trade-off between porosity and bulk density in this copper foam?

This copper foam offers porosity from 50% to 98% and bulk density from 0.1 to 0.8 g/cm³. Higher porosity corresponds to lower bulk density, which is beneficial for lightweight thermal and EMI shielding applications while maintaining a high specific surface area.

Is this copper foam suitable for use as a battery electrode material and EMI shielding?

Yes, its excellent electrical conductivity and ≥98% through-hole rate make it suitable for nickel-zinc battery electrodes, electric double-layer capacitors, and electromagnetic shielding. The through-hole structure ensures efficient ion transport and effective shielding performance close to silver.

What are the available sizes and customization options for this copper foam?

The product is available in sizes 100mm×100mm×1.7mm, 200mm×300mm×5mm, 300mm×300mm×2mm, and 400mm×500mm×10mm. Custom sizes can be provided on request; contact the engineering team at inquiry@atomfair.com for specific requirements.

Assessment

This variable-format copper foam spans 50–98% porosity, a ≥98% through-hole rate, and 0.1–10 mm pore size, with size/thickness variants from 100×100×1.7 mm to 400×500×10 mm. Its conductive, thermally conductive, EMI-shielding, filtering, and catalytic functions make it a strong candidate for porous electrode and heat-transfer media, provided the specified pore and dimensional variant is matched to the duty.

Positive

Interconnected through-hole porous structure: Porosity from 50% to 98% with ≥98% through-hole rate and 0.1–10 mm pore size creates a high-surface-area, permeable metal skeleton suitable for electrode, filtration, catalyst, and acoustic applications.
Conductive, thermal, and EMI functions: The copper foam combines excellent thermal and electrical conductivity with EMI shielding performance close to silver, enabling heat dissipation, electrode current collection, and electromagnetic shielding in one porous structure.

Trade-offs

Wide specification ranges require careful matching: No single grade covers all duties: porosity spans 50–98%, pore size 0.1–10 mm, bulk density 0.1–0.8 g/cm³, and available size/thickness variants range from 100×100×1.7 mm to 400×500×10 mm, so the exact combination must be specified for the intended application.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).