Aluminum Nitride Substrate 20×20×0.5 mm Pack of 10 ATOMFAIR®

This substrate requires careful handling to prevent mechanical damage due to its high hardness and brittleness. Surface roughness and dimensional tolerances must be verified before processing to ensure compatibility with subsequent metallization or bonding steps.

• Mechanical fragility: Avoid impact or bending loads during handling to prevent fracture given the flexural strength exceeds 400 MPa but the material is brittle.
• Surface condition verification: Confirm surface roughness Ra of 0.2-0.3 µm before coating or metallization to ensure adequate adhesion.
• Thermal expansion matching: Use with components having similar thermal expansion coefficients to minimize stress during thermal cycling.

These substrates require clean, controlled handling to avoid contamination and mechanical damage. Proper cleaning and inspection steps ensure reliable performance in electronic assembly workflows.

Required Equipment: Cleanroom gloves, Isopropyl alcohol, Lint-free wipes, Optical microscope

1. Inspect substrate
   Visually inspect each substrate under an optical microscope for cracks, chips, or surface defects before use.
2. Clean surface
   Wipe the substrate surface with isopropyl alcohol using a lint-free wipe to remove particulate contamination.
3. Dry thoroughly
   Allow the cleaned substrate to air dry completely in a clean environment before any coating or bonding step.
4. Handle with care
   Hold the substrate only by the edges using cleanroom gloves to avoid leaving residues or causing edge chipping.

This 20 mm x 20 mm x 0.5 mm aluminum nitride ceramic substrate provides thermal conductivity exceeding 170 W/(m·K), approximately 7–10 times higher than alumina, with a coefficient of thermal expansion matching silicon to reduce thermomechanical stress in power module assemblies. The material's flexural strength >400 MPa and Vickers hardness of 11 GPa offer structural durability, but its 0.2–0.3 μm surface roughness and fragility under mechanical shock impose handling and polishing considerations for direct-bond-copper or thin-film deposition workflows.

Positive

• High thermal conductivity: Thermal conductivity >170 W/(m·K) at 25 °C enables efficient heat spreading in power electronics and LED modules, significantly outperforming alumina substrates by a factor of 7–10.
• CTE matched to silicon: Thermal expansion coefficient similar to silicon reduces interfacial stress during thermal cycling, improving reliability in direct-bonded power module assemblies.

Trade-offs

• Fragile under mechanical stress: Despite high flexural strength >400 MPa, ceramic substrates are brittle and require careful handling during dicing, mounting, and wire bonding to avoid edge chipping or fracture.
• Surface roughness limits adhesion: As-fired surface roughness Ra 0.2–0.3 μm necessitates polishing or surface treatment before thin-film metallization or direct-bond-copper processes to ensure adequate adhesion.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).