96% Alumina Ceramic Substrate, 100 mm x 100 mm x 1 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What are the key mechanical and thermal specifications of the Atomfair AF-A96-S100P100 96% alumina substrate?
The AF-A96-S100P100 is a 96% Al2O3 technical ceramic substrate with a white dense appearance, surface roughness of Ra 0.15-0.30 µm, density ≥3.70 g/cm³, flexural strength >350 MPa, Vickers hardness 14 GPa, and thermal conductivity >24 W/(m·K). These values are specified for the 100 mm x 100 mm x 1 mm substrate selection.
Can the AF-A96-S100P100 96% alumina substrate be supplied with metallization, polishing, or custom shapes?
Yes, metallization, polishing, coating, and custom-shape options can be matched to the application, but they must be confirmed with Atomfair at the quotation stage. The standard selected specification is 100 mm x 100 mm x 1 mm in a pack of 10; quote requests should also verify size tolerance, thickness, material grade, surface finish, and package format.
What dielectric and thermal properties does this 96% alumina substrate provide for high-voltage or heat-dissipating applications?
The 96% Al2O3 grade is specified with low dielectric constant and dielectric loss, a breakdown voltage of at least 15 kV/mm, and thermal conductivity above 24 W/(m·K), which are relevant when both electrical isolation and thermal conductivity are needed. It also offers high mechanical strength, hardness, corrosion resistance, and chemical stability for demanding laboratory or device applications.
This 96% alumina ceramic substrate (100 mm x 100 mm x 1 mm, pack of 10) provides a balance of high mechanical strength (>350 MPa flexural), electrical insulation (breakdown voltage ≥15 kV/mm), and moderate thermal conductivity (>24 W/(m·K)), making it suitable for thin-film deposition, thick-film circuits, or insulating heat sinks in laboratory or prototype environments.
Positive
- High dielectric strength and thermal conductivity: With a breakdown voltage ≥15 kV/mm and thermal conductivity exceeding 24 W/(m·K), the substrate supports electrical isolation with moderate heat dissipation in power electronic or RF applications.
- Good mechanical robustness for handling: Flexural strength >350 MPa and Vickers hardness of 14 GPa provide resistance to fracture during dicing, clamping, or thermal cycling, reducing breakage risk in lab processing.
Trade-offs
- Surface roughness may require polishing: With an as-fired surface roughness of Ra 0.15-0.30 μm, the substrate may need additional polishing for thin-film metallization or photolithography, adding a processing step for finer line resolution.
- Limited size and fixed thickness for custom builds: Selected as 100 mm × 100 mm × 1 mm in a pack of 10, this specification cannot be adjusted without custom ordering; users requiring non-standard dimensions or tighter thickness tolerances must request special fabrication, potentially extending lead time.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
