96% Alumina Ceramic Substrate, 100 mm x 100 mm x 0.5 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
|
The substrate exhibits high mechanical strength but is susceptible to brittle fracture under point loading or thermal shock. Surface roughness and flatness tolerances must be verified prior to thin-film deposition or photolithographic processing.
- Surface Quality Constraint: Surface roughness of Ra 0.15–0.30 μm must be confirmed for adhesion of subsequent coatings or metallization layers.
- Thermal Management Constraint: Thermal conductivity exceeding 24 W/(m·K) requires controlled ramp rates during sintering or annealing to prevent thermal stress fracture.
- Dielectric Integrity Constraint: Breakdown voltage of at least 15 kV/mm necessitates clean handling to avoid surface contamination that could reduce insulation performance.
Clean the substrate surface to remove particulate contamination before any coating or bonding process. Verify dimensional tolerances and surface finish against application requirements prior to use.
Required Equipment: Cleanroom-grade lint-free wipes, Isopropyl alcohol (IPA) or acetone, Ultrasonic bath (optional), Vacuum tweezers or edge-grip handling tool
- Inspect substrate for defects
Visually examine each substrate under bright light for chips, cracks, or surface contamination before processing. - Clean the substrate surface
Wipe the substrate with a lint-free wipe saturated with isopropyl alcohol to remove organic residues and particulate matter. - Dry the substrate completely
Allow the cleaned substrate to air dry in a particle-free environment or use a gentle nitrogen blow-off to remove solvent traces. - Handle substrate by edges only
Use vacuum tweezers or edge-grip tools to lift and transfer the substrate, avoiding contact with the planar surfaces. - Store substrates in protective packaging
Place cleaned and dried substrates back into the original foam-lined tray or a cleanroom-grade wafer carrier to prevent scratching.
Can a 96% alumina ceramic substrate simultaneously provide high electrical insulation, useful thermal conductivity, and mechanical strength?
Yes. The 96% Al2O3 ceramic combines electrical insulation with a breakdown voltage of at least 15 kV/mm and useful thermal conductivity above 24 W/(m·K), while maintaining flexural strength above 350 MPa and Vickers hardness of 14 GPa. The material also offers low dielectric constant and low dielectric loss, which is relevant for applications requiring both electrical and thermal performance.
What critical parameters should be verified before integrating the 100 mm x 100 mm x 0.5 mm 96% alumina substrate into a device?
Verify size tolerance, thickness requirement, material grade, surface finish, and package format before ordering. The selected specification is 100 mm x 100 mm x 0.5 mm with a surface roughness of Ra 0.15-0.30 µm and a density of at least 3.70 g/cm³; the quotation also requires confirmation of the AF-A96-S100P050 model, pack quantity of 10, and total required quantity.
What should be specified when requesting a quote for polishing, coating, metallization, or custom-shape processing of this ceramic substrate?
Confirm the required option during option matching: polishing, coating, metallization, or custom-shape needs. The configuration confirmation also asks you to verify size tolerance, thickness, material grade, surface finish, and package format, and the quotation request should include the exact size, thickness, color or package detail, and quantity.
This 96% alumina ceramic substrate (100 mm x 100 mm x 0.5 mm) provides a combination of high flexural strength (>350 MPa), electrical insulation, and thermal conductivity (>24 W/(m·K)), making it suitable for demanding technical ceramic applications; however, the thin 0.5 mm thickness introduces mechanical fragility and requires careful handling during processing.
Positive
- High thermal conductivity: With thermal conductivity >24 W/(m·K) and low dielectric loss, this substrate efficiently dissipates heat in electronic or insulating assemblies where alumina's electrical insulation is required.
- Corrosion-resistant dense ceramic: The white dense 96% Al2O3 body provides good chemical stability and corrosion resistance, reducing reactivity in harsh laboratory or processing environments.
Trade-offs
- Fragile at 0.5 mm thickness: The 0.5 mm thickness, combined with ceramic brittleness (hardness 14 GPa, flexural strength >350 MPa), increases risk of fracture during cutting, drilling, or handling without specialized tooling.
- Surface roughness tolerance required: Surface roughness of Ra 0.15–0.30 μm may necessitate additional polishing or coating steps for applications requiring ultra-smooth interfaces, adding processing complexity.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
