96% Alumina Ceramic Substrate, 100 mm x 100 mm x 0.635 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What is the thermal conductivity of this 96% alumina substrate and how does it relate to dielectric loss for high-frequency applications?
The thermal conductivity is >24 W/(m·K), while the dielectric loss is low, making this substrate suitable for high-frequency circuits where heat dissipation and signal integrity are required.
What is the maximum breakdown voltage rating for this 0.635 mm thick 96% alumina substrate?
With a breakdown voltage of ≥15 kV/mm, the maximum breakdown voltage for this 0.635 mm thick substrate is at least 9.5 kV, enabling use in high-voltage isolation applications.
What surface roughness (Ra) is typical for this substrate and does it require additional polishing for thin film deposition?
The surface roughness is Ra 0.15–0.30 μm. While adequate for many processes, critical thin film deposition may require further polishing to achieve a smoother surface.
This 96% alumina ceramic substrate (100 mm x 100 mm x 0.635 mm, pack of 10) offers a balanced combination of high flexural strength (>350 MPa), electrical insulation (breakdown voltage ≥15 kV/mm), and moderate thermal conductivity (>24 W/(m·K)), making it suitable for insulating and heat-dissipating substrates in electronic or thin-film applications. The specified surface roughness range (Ra 0.15–0.30 μm) and density (≥3.70 g/cm³) provide predictable baseline properties for laboratory process integration.
Positive
- High mechanical strength and insulation: Flexural strength >350 MPa and breakdown voltage ≥15 kV/mm provide structural robustness and reliable electrical isolation for substrate applications.
- Useful thermal conductivity for alumina: Thermal conductivity >24 W/(m·K) facilitates modest heat spreading in power-dense assemblies, beneficial for lab-scale device prototyping.
Trade-offs
- Surface roughness requires post-processing: As-fired surface roughness Ra 0.15–0.30 μm may necessitate polishing or lapping for thin-film adhesion or metallization processes, adding fabrication steps.
- Brittle ceramic handling precautions needed: Despite high flexural strength, the substrate is a ceramic plate susceptible to edge chipping or fracture under mechanical shock or improper clamping, requiring careful handling and mounting.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
