Aluminum Nitride Ceramic Substrate, 20 mm x 20 mm x 0.63 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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How does the thermal conductivity of this 20 mm x 20 mm x 0.63 mm aluminum nitride substrate compare with alumina?
This aluminum nitride substrate is rated above 170 W/(m·K) at 25 °C, which is about 7–10 times higher than alumina ceramic. That high thermal conductivity, together with low dielectric constant and low dielectric loss, supports heat-dissipation and insulating-substrate use in power modules and electronic component workflows.
Is the thermal expansion of this AlN substrate compatible with silicon for power module assembly?
Yes. The product description states that the thermal expansion of this aluminum nitride ceramic is close to silicon, making it suitable for power module and electronic component workflows. The selected substrate measures 20 mm x 20 mm x 0.63 mm and has a surface roughness Ra of 0.2–0.3 µm; if coating, metallization, polishing, or a custom shape is required, confirm those options with Atomfair before quotation.
What mechanical and electrical ratings should be considered when handling this 0.63 mm aluminum nitride ceramic substrate?
The substrate has a flexural strength above 400 MPa, a fracture toughness of 3.0 MPa√m, a Vickers hardness of 11 GPa, and a Young modulus of 320 GPa. Its DC breakdown voltage is 15 kV/mm and density is 3.3 g/cm³. Treat it as a technical ceramic and confirm size tolerance, thickness, material grade, surface finish, and package format before procurement.
This aluminum nitride ceramic substrate (20 mm x 20 mm x 0.63 mm, pack of 10) delivers a thermal conductivity above 170 W/(m·K), approximately 7-10 times higher than alumina, with a thermal expansion coefficient closely matched to silicon, making it suitable for power module and high-heat-dissipation electronic substrate applications.
Positive
- High thermal conductivity for heat dissipation: Thermal conductivity exceeds 170 W/(m·K), about 7-10 times higher than alumina ceramic, providing superior heat spreading for electronic and power module substrates.
- CTE matched to silicon: Thermal expansion coefficient is close to silicon, reducing thermomechanical stress during thermal cycling in power module and electronic component assemblies.
Trade-offs
- Requires verification of surface finish and tolerances: Size tolerances, thickness requirements, and surface finish (Ra 0.2-0.3 µm) must be confirmed with the supplier before ordering to ensure fit in precision workflows.
- No metallization or coating applied: The substrate is supplied as a bare ceramic item; polishing, coating, metallization, or custom shaping must be separately specified and may add processing steps.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
