96% Alumina Ceramic Substrate, 50 mm x 50 mm x 1 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What electrical insulation and thermal performance does the 96% alumina ceramic substrate provide?
The 96% Al2O3 substrate provides low dielectric constant and low dielectric loss with a breakdown voltage of 15 kV/mm. Its useful thermal conductivity is specified as >24 W/(m·K).
Can this 50 mm × 50 mm × 1 mm 96% alumina substrate be supplied with polishing, coating, metallization, or custom shaping?
The listed product is an independent substrate item with a specified surface roughness of Ra 0.15–0.30 µm and no pre-applied polishing, coating, or metallization described. Polishing, coating, metallization, or custom-shape needs should be confirmed with the technical sales team before quotation, along with size tolerance, thickness requirement, material grade, surface finish, and package format.
What mechanical strength does the 96% alumina substrate have for handling and fixturing?
This technical ceramic has flexural strength >350 MPa, Vickers hardness 14 GPa, and a density of 3.70 g/cm³, indicating high mechanical strength for a 96% Al2O3 substrate. The performance features also list high hardness and melting point as inherent material properties.
This 96% alumina ceramic substrate offers high mechanical strength (>350 MPa flexural), electrical insulation (≥15 kV/mm breakdown voltage), and useful thermal conductivity (>24 W/(m·K)) for demanding laboratory and thin-film substrate applications, but its as-fired surface roughness (Ra 0.15–0.30 μm) and brittle nature require careful handling and potential post-processing for precision metallization.
Positive
- High mechanical strength and hardness: With flexural strength >350 MPa and Vickers hardness of 14 GPa, this substrate provides robust structural integrity for mounting and processing under mechanical loads.
- Excellent electrical insulation and thermal conductivity: Breakdown voltage ≥15 kV/mm ensures reliable electrical isolation, while thermal conductivity >24 W/(m·K) supports heat dissipation in high-power or thermally sensitive setups.
Trade-offs
- Surface roughness requires post-processing: The as-fired surface roughness of Ra 0.15–0.30 μm may necessitate polishing or planarization for applications requiring smooth interfaces, such as thin-film deposition or precise metallization.
- Brittle ceramic prone to chipping: As a high-hardness ceramic, the substrate is brittle and may chip or crack under mechanical shock or improper handling, requiring careful fixturing and machining protocols.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).






