96% Alumina Ceramic Substrate, 150 mm x 150 mm x 1 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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How does the thermal conductivity of the 96% alumina ceramic substrate compare to its electrical breakdown strength for high-power applications?
The substrate has a thermal conductivity >24 W/(m·K) and a breakdown voltage ≥15 kV/mm, providing a balance of heat dissipation and electrical insulation suitable for high-power electronic substrates. The low dielectric constant and dielectric loss further support high-frequency performance.
What surface roughness range is specified for the 96% alumina substrate, and is it compatible with standard metallization processes?
The surface roughness is Ra 0.15–0.30 µm, a range typical for thick-film metallization. The product description indicates that polishing, coating, or metallization options are available upon request, allowing customization for specific deposition methods.
What are the mechanical handling requirements for the 1 mm thick 96% alumina ceramic substrate to avoid fracture during processing?
With a flexural strength >350 MPa and Vickers hardness 14 GPa, the substrate is mechanically strong but brittle. The 1 mm thickness requires careful handling and support during cutting or drilling. The product description advises confirming size tolerance, thickness, and surface finish before procurement.
This 96% alumina ceramic substrate (150 mm x 150 mm x 1 mm, pack of 10) offers a high mechanical strength exceeding 350 MPa flexural strength and a breakdown voltage of ≥15 kV/mm, making it suitable for demanding electrical insulation applications in laboratory settings. Its low dielectric constant and dielectric loss, combined with thermal conductivity >24 W/(m·K), support use as a substrate for thin-film or thick-film circuits, though the specified surface roughness (Ra 0.15–0.30 μm) may require post-processing for critical metallization steps.
Positive
- High mechanical and electrical strength: Flexural strength >350 MPa and breakdown voltage ≥15 kV/mm provide robust structural integrity and reliable insulation for high-voltage or load-bearing applications.
- Combined thermal and dielectric performance: Thermal conductivity >24 W/(m·K) aids heat dissipation, while low dielectric constant and loss enable efficient signal transmission in RF or microwave circuits.
Trade-offs
- Surface finish requires verification: Surface roughness of Ra 0.15–0.30 μm may necessitate additional polishing or planarization for thin-film metallization or fine-pitch circuit patterning.
- Material density influences handling weight: Density ≥3.70 g/cm³ results in a mass of approximately 83 g per substrate, which may require careful handling and mounting to avoid mechanical stress during processing.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
