Tantalum Nitride TaN Pellets 99.9% 25μm E-Beam ATOMFAIR®

Price range: $350.00 through $3,000.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade TaN evaporation pellets, 99.9% pure with 25μm size range for E-beam deposition using compatible liner; packs 25g, 100g, 500g, 1kg. Order now.

Tantalum Nitride (TaN) Evaporation Material, Pellets, 99.9%, 25 µm
Product Type: Compound Evaporation Material
Research-grade laboratory product
Product Overview

Tantalum Nitride (TaN) Evaporation Material, Pellets, 99.9%, 25 µm is a research-grade compound evaporation material supplied as Pellets with 99.9% material specification and Pellets 25 µm size range for vacuum thin-film deposition workflows.

This evaporation material is prepared for laboratory procurement where material identity, purity, physical form, pack size and deposition hardware must be confirmed before ordering. The listed configuration supports selection for E-beam evaporation preferred; RFQ for thermal feasibility using E-beam hearth with compatible liner; high-temperature crucible by RFQ | Sheet2 hardware: – | – | – | – | -.

Available pack sizes are 25g / 100g / 500g / 1kg. Buyers should confirm deposition source geometry, required quantity, certificate requirements and shipment conditions before quotation.

Performance Features
  • Defined material identity: Tantalum Nitride (TaN) for clear procurement and deposition-process matching.
  • Specified physical form: Pellets with Pellets 25 µm sizing to support source loading and evaporation review.
  • Purity or composition listed as 99.9%, allowing comparison between standard, high-purity and RFQ-controlled grades.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-TANPEL-3N25UM
Material Tantalum Nitride
Formula TaN
Product Type Compound Evaporation Material
Form Pellets
Purity / Composition 99.9%
Particle Size / Dimensions Pellets 25 µm
Minimum Order Quantity 25g
Available Pack Sizes 25g / 100g / 500g / 1kg
Indicative Price Tiers 25g: USD 350; 100g: USD 800; 500g: USD 2100; 1kg: USD 3000
Evaporation Source E-beam hearth with compatible liner; high-temperature crucible by RFQ | Sheet2 hardware: – | – | – | – | –
Evaporation Method E-beam evaporation preferred; RFQ for thermal feasibility
Melting Point 3,360
Density 16.3
Z-Ratio **1.00
PROCUREMENT CHECK: Confirm model, purity, form, size range, pack size and deposition-source compatibility before quotation.
DOCUMENTATION REVIEW: Certificate, safety data sheet, shipment condition and export requirements can be reviewed against laboratory use requirements.
APPLICATION MATCHING: Evaporation source hardware and process route should be matched to material behavior, melting point and film requirements.
INQUIRY NOTE: Include the required model, purity, form, size range and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This material requires e-beam evaporation with a compatible liner or high-temperature crucible due to its high melting point of 3360°C. The 25 µm pellet form demands careful source loading to ensure uniform evaporation and prevent process instability.

  • Evaporation Method: E-beam evaporation is required; thermal evaporation is not recommended without prior feasibility confirmation due to the high melting point.
  • Crucible Selection: Use a crucible material compatible with tantalum nitride at temperatures exceeding 3360°C to avoid chemical reaction or degradation.
  • Pellet Handling: Handle pellets in a clean, dry environment to prevent contamination that could affect film purity.
  • Source Loading: Load pellets uniformly to ensure consistent evaporation and avoid spitting or uneven deposition.
  • Process Monitoring: Monitor deposition rate closely as the high density may cause deviations from expected thickness readings.

Why is E-beam evaporation preferred over thermal evaporation for Tantalum Nitride (TaN) pellets, and what are the trade-offs?

E-beam evaporation is preferred for TaN because the material has a high melting point of 3,360°C, which E-beam sources can reach without crucible contamination. Thermal evaporation may be feasible but requires an RFQ to confirm compatible crucible and liner hardware, as standard thermal boats may not withstand the temperature or may react with the nitride.

What liner or crucible compatibility constraints exist when evaporating TaN pellets via E-beam, and how does the 25 µm pellet size affect source loading?

The product literature specifies using an E-beam hearth with a compatible liner; the exact liner material is not listed and must be confirmed via RFQ for high-temperature crucible options. The 25 µm pellet size is suitable for consistent source loading and uniform evaporation, but buyers should verify that their hearth geometry accommodates this form factor.

What is the significance of the Z-Ratio of 1.00 for TaN in quartz crystal microbalance thickness monitoring during deposition?

A Z-Ratio of 1.00 indicates that the acoustic impedance of TaN matches that of quartz, simplifying thickness monitor calibration and improving deposition rate accuracy. This spec, combined with the 99.9% purity and 25 µm pellet form, allows researchers to set up reliable process control without tooling factor adjustments for the material.

Tantalum Nitride (TaN) evaporation pellets at 99.9% purity and 25 µm size are evaluated for E-beam deposition, offering high thermal stability (melting point 3,360°C) and density (16.3 g/cm³) suitable for hard, conductive thin films, but requiring careful source compatibility and handling due to high-temperature processing constraints.

Positive

  • High melting point for stable deposition: With a melting point of 3,360°C, TaN pellets enable high-temperature evaporation processes, supporting the formation of dense, refractory thin films suitable for demanding applications like diffusion barriers in semiconductor devices.
  • Defined purity and form for reproducibility: The 99.9% purity and specified 25 µm pellet form ensure consistent material composition and predictable evaporation behavior, critical for achieving repeatable film properties in research and production environments.

Trade-offs

  • E-beam evaporation preferred; thermal limited: The material is optimized for E-beam evaporation using a compatible hearth liner; thermal evaporation requires RFQ feasibility assessment, adding process validation steps for alternative deposition methods.
  • High density requires careful source loading: With a density of 16.3 g/cm³, the pellets are relatively heavy, necessitating confirmation of source geometry and crucible compatibility to avoid loading issues or uneven evaporation rates during deposition.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

25g, 100g, 500g, 1kg

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