SPIN COATER AF-4SC 7000 RPM BUILT-IN VACUUM PUMP SEMICONDUCTOR COATINGRESEARCH GRADE EQUIPMENT
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TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official quotations.
EMAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The built-in vacuum pump activates automatically upon lid closure, requiring verification of adequate substrate hold-down before initiating spin rotation. The safety interlock prevents motor operation unless the lid is fully closed, and bypassing this feature is prohibited.
- Power Supply Constraint: The instrument operates at AC 220 V / 50 Hz, requiring verification of local power supply compatibility before installation.
- Substrate Size Constraint: The 46 mm standard chuck accommodates substrates up to approximately 2 inches, with larger substrates potentially requiring adapter chucks.
- Chamber Cleaning Requirement: Clean the 140 mm chamber and chuck surface after each use to prevent cross-contamination between coating runs.
Place the substrate on the 46 mm vacuum chuck and close the lid to activate the built-in vacuum pump automatically. Program the desired spin profile using the multi-segment control, then initiate rotation after verifying secure substrate hold-down.
Required Equipment: AF-4SC Spin Coater, 46 mm Vacuum Chuck
- Place Substrate
Place the substrate centrally on the 46 mm vacuum chuck within the 140 mm chamber. - Close Lid
Close the lid securely to activate the built-in vacuum pump and engage the safety interlock. - Verify Hold-Down
Verify adequate substrate hold-down by confirming the vacuum has engaged before initiating spin rotation. - Program Spin Profile
Program the desired multi-segment spin profile using the ST16-bit MCU control with PWM speed regulation. - Initiate Rotation
Initiate spin rotation within the 500–7000 rpm range using the programmed recipe. - Stop and Open Lid
Allow the spin cycle to complete, then open the lid to release the vacuum and remove the coated substrate. - Clean Chamber
Clean the 140 mm chamber and chuck surface after each use to prevent cross-contamination.
What is the speed increment of the AF-4SC spin coater and how does it affect process control?
The AF-4SC has a fixed speed increment of 500 rpm, meaning speed can only be set in 500 rpm steps (500–7000 rpm). While this limits fine-grained speed selection, the ST16-bit MCU with multi-segment programmable control allows staged acceleration and dwell sequences to achieve precise coating uniformity and reproducibility.
What substrate sizes are compatible with the standard AF-4SC spin coater chuck and how can larger substrates be accommodated?
The standard chuck diameter is 46 mm, accommodating substrates up to approximately 2 inches. For larger substrates or custom requirements, other chuck sizes and configurations are available upon request via email. Contact Atomfair's engineering team for tailored solutions.
How does the built-in vacuum pump and safety interlock work on the AF-4SC spin coater?
The built-in negative pressure pump activates automatically upon lid closure, providing immediate substrate hold-down without external vacuum connections. The lid-closure safety interlock prevents motor operation unless the lid is fully closed, protecting users from high-speed rotating components. This integrated design eliminates additional setup steps and enhances lab safety.
The AF-4SC spin coater integrates a 7000 rpm built-in vacuum pump with auto-activation upon lid closure and ST16-bit MCU PWM speed regulation, enabling reproducible multi-segment spin profiles for semiconductor wafer and MEMS coating. Its ultra-compact 2 kg footprint and PPTC self-resetting fuse suit glovebox and space-constrained lab environments, though the 500 rpm speed increment and 46 mm chuck limit fine-resolution and substrate size flexibility.
Positive
- Built-in vacuum pump with auto-activation: The integrated negative pressure pump automatically engages when the lid closes, eliminating external vacuum connections and reducing setup steps for immediate substrate hold-down in glovebox and cleanroom workflows.
- Compact 2 kg form factor: At 194 × 229 × 120 mm and 2 kg, the coater is optimized for glovebox integration and space-constrained benches where larger floor-standing units are impractical, with easy portability between lab stations.
Trade-offs
- Fixed 500 rpm speed increment: The minimum step size of 500 rpm limits fine-tuning of spin speed for processes requiring sub-500 rpm resolution, such as ultra-thin film deposition or low-viscosity coating protocols.
- Standard 46 mm chuck restricts substrate size: The included 46 mm chuck accommodates substrates up to ~2 inches; larger substrates require custom adapters, and the 140 mm chamber diameter may impose further geometric constraints on sample placement.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
