SPIN COATER AF-6PRO 10000 RPM PROGRAMMABLE THIN FILM DEPOSITIONRESEARCH GRADE EQUIPMENT
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TAILORED SOLUTIONS FOR RESEARCH
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The AF-6pro spin coater requires a 220 V / 50 Hz power supply and a connected vacuum pump for safe substrate hold-down. Maximum rotational speed of 10000 rpm must only be used with appropriately sized and balanced substrates to prevent mechanical failure.
- Vacuum Requirement: Verify the vacuum pump is connected and operational before loading any substrate onto the chuck.
- Substrate Loading Constraint: Ensure the substrate is centered on the vacuum chuck and adequate vacuum hold-down pressure is achieved prior to initiating spin rotation.
- Speed Limitation: The maximum speed of 10000 rpm should only be used with appropriately sized substrates and well-balanced loading conditions.
- Post-Use Cleanliness: Clean the spin bowl and chuck surface after each use to prevent cross-contamination between coating materials.
- Power Supply Compatibility: Verify local power supply compatibility (220 V / 50 Hz) before installation to avoid electrical hazards.
Connect the vacuum pump and power supply, then load and center the substrate before initiating the spin program. After use, clean the spin bowl and chuck to maintain operational safety and prevent contamination.
Required Equipment: AF-6pro Spin Coater, Vacuum pump, Vacuum chuck (appropriate size)
- Connect vacuum pump
Connect and verify that the vacuum pump is operational before loading any substrate onto the chuck. - Load substrate
Place the substrate centrally on the vacuum chuck and ensure adequate vacuum hold-down pressure is achieved. - Set spin parameters
Program the desired spin speed, acceleration, and dwell time using the 5-inch touch screen interface. - Initiate spin
Start the spin cycle and monitor the process through the transparent viewing window. - Stop and remove substrate
After the spin cycle completes, stop the rotation, release vacuum, and carefully remove the coated substrate. - Clean chamber
Clean the spin bowl and chuck surface after each use to prevent cross-contamination between coating materials.
What is the maximum substrate size that can be used at the AF-6pro's top speed of 10,000 rpm?
The AF-6pro spin coater accepts substrates from fragments up to 6-inch round wafers, but the maximum speed of 10,000 rpm should only be used with appropriately sized substrates and well-balanced loading conditions. The source does not specify a precise size limit for 10,000 rpm operation, but cautions that large or unbalanced substrates at that speed may cause instability; therefore, users should verify safe loading for their specific substrate size and weight.
Does the AF-6pro spin coater include a vacuum pump, or does it require an external pump?
The AF-6pro does not include a vacuum pump. The instrument requires an external vacuum pump to be connected and operational before loading substrates. The on-screen vacuum level display and manual pressure adjustment knob allow precise control of hold-down force, but the pump itself is not supplied; users must provide a compatible pump and verify proper connection before each use.
What are the recommended cleaning and maintenance procedures for the AF-6pro spin coater?
Clean the spin bowl and chuck surface after each use to prevent cross-contamination between coating materials. Before operation, always verify that the vacuum pump is connected and operational, center the substrate on the chuck, and ensure adequate hold-down pressure before initiating spin rotation. The maximum speed of 10,000 rpm should only be used with appropriately sized and well-balanced substrates, and the instrument operates at 220 V / 50 Hz, so verify local power supply compatibility.
The AF-6pro spin coater delivers 10000 rpm PLC-controlled thin film deposition with a transparent flip lid and concentric dispensing port, enabling real-time process monitoring and uniform precursor delivery for substrates up to 6-inch wafers. Its on-screen vacuum display and manual adjustment knob provide precise hold-down force control, critical for delicate or flexible substrates, while the requirement for an external vacuum pump and 220 V / 50 Hz power supply are operational constraints to plan for in lab infrastructure.
Positive
- PLC programmable control with touch screen: The PLC-based system with a 5-inch full-color touch screen enables precise multi-step recipe programming for repeatable spin speed ramps, dwell times, and acceleration profiles, essential for reproducible thin film deposition in semiconductor and MEMS processes.
- Wide substrate compatibility range: Processes substrates from small fragments up to 6-inch standard circular wafers and irregular-shaped substrates, accommodating diverse research needs for silicon, glass, quartz, and sapphire wafers in lithography and optoelectronic applications.
Trade-offs
- Requires external vacuum pump: The vacuum chuck system depends on an external vacuum pump that must be connected and operational before loading substrates; the unit does not include a built-in pump, requiring separate acquisition and laboratory infrastructure planning.
- Limited to 220 V / 50 Hz power input: The instrument operates exclusively on 220 V / 50 Hz power supply; facilities with 110 V mains or 60 Hz systems must verify compatibility and may require a step-up transformer or frequency converter, adding installation complexity.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
