Quartz Glass Substrate 4 in 500±25 μm Ra <0.5 nm ATOMFAIR®

$314.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade quartz glass substrate, 4 inch (100 mm) diameter, 500±25 μm thick, Ra <0.5 nm, <5 μm flatness, Scratch/Dig 40/20, 25 pcs/box. Order now.

SKU: AF-WF-S-GLAS-04IN-G073
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Quartz glass Substrate – 4 inch (100 mm), 25 pcs/box
Product Type: Glass substrate
Research-grade laboratory product
Product Overview

Quartz glass substrate in 4 inch (100 mm) format is supplied with Ra <0.5 nm roughness, <5 um flatness and Scratch/Dig 40/20 surface quality.

Select the material, format and package quantity that match your optical substrate requirements.

Performance Features
  • Quartz glass material is available for this substrate configuration.
  • Surface quality includes Ra <0.5 nm roughness, <5 um flatness and Scratch/Dig 40/20.
  • The format and package quantity are shown clearly for straightforward product selection.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-GLS-J104I25
Material Quartz glass
Format / Diameter 4 inch (100 mm)
Typical Thickness 500 +/- 25 um
Flat Length / Notch 30 mm
Roughness Ra <0.5 nm
Flatness <5 um
Surface Quality Scratch/Dig 40/20
Package 25 pcs/box
Material Details: Select Quartz glass, 4 inch (100 mm) format and 25 pcs/box package.
Specification Details: Select thickness, flat or square-format requirements and surface quality expectations for the requested substrate.
Ordering Details: Share the selected model, configuration, quantity and any thickness or packaging preference.
PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

The substrate surface quality of Scratch/Dig 40/20 and roughness Ra <0.5 nm require contamination-free handling to avoid defects. Flatness below 5 um necessitates careful mounting to prevent warping or stress-induced distortion.

  • Surface Contamination Risk: Contact with bare skin or non-cleanroom gloves can deposit oils or particles that degrade the specified Scratch/Dig 40/20 surface quality.
  • Mechanical Stress Sensitivity: Excessive clamping force or uneven support during processing may induce bowing that exceeds the <5 um flatness tolerance.

These steps ensure the substrate maintains its specified surface quality and flatness during unpacking and inspection. Use only cleanroom-grade tools and work surfaces to prevent contamination.

Required Equipment: Cleanroom-grade tweezers or vacuum wand, Lint-free cleanroom wipes, Particle-free compressed air or nitrogen gun

  1. Prepare Work Area
    Set up a clean, static-dissipative work surface in a Class 100 or better cleanroom environment.
  2. Inspect Packaging
    Verify the box seal is intact and the substrates are separated by interleaving sheets to prevent scratching.
  3. Remove Substrate
    Grasp the substrate edge with cleanroom tweezers or a vacuum wand, avoiding contact with the front or back surfaces.
  4. Clean Surface
    Gently blow off any loose particles using particle-free compressed air at low pressure.
  5. Inspect for Defects
    Examine the substrate under bright, diffuse light for scratches, digs, or particulate contamination exceeding the 40/20 specification.

What is the significance of the 30 mm flat length on a 4-inch (100 mm) quartz substrate?

The 30 mm flat provides a primary orientation reference for alignment in semiconductor processing equipment. This standard flat length ensures compatibility with wafer handling systems that rely on a flat edge for rotational alignment, critical for photolithography and etching steps.

How does the ±25 µm thickness tolerance of the 500 µm quartz substrate impact thin-film deposition uniformity?

The thickness variation of ±25 µm can cause minor differences in thermal mass and capacitance across the substrate, potentially affecting the uniformity of deposited films in processes like PECVD or sputtering. For high-uniformity requirements, tighter thickness control may be necessary, but the specified tolerance is typical for standard research-grade substrates.

This 4-inch quartz glass substrate (AF-WF-S-GLAS-04IN-G073) offers a surface roughness of Ra <0.5 nm, flatness <5 µm, and Scratch/Dig 40/20 quality, making it suitable for demanding optical and thin-film applications where low scatter and precise substrate geometry are required.

Positive

  • Ultra-low surface roughness: Ra <0.5 nm roughness minimizes optical scatter and provides a smooth foundation for thin-film deposition or photolithography.
  • High surface quality specification: Scratch/Dig 40/20 ensures minimal surface defects, critical for high-precision optical and semiconductor processing.

Trade-offs

  • Thin substrate handling required: At 500 ±25 µm thickness, the substrate is mechanically fragile and requires careful handling to avoid breakage during processing or transfer.
  • Flatness constraint for large-area use: Flatness <5 µm may limit performance in applications requiring sub-micron planarity over the full 100 mm diameter, such as advanced lithography.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).