Platinum-Coated Substrate 2 in Ti/Pt Stack ATOMFAIR®

The platinum film stack is sensitive to mechanical abrasion and contamination, requiring cleanroom-grade handling to maintain sub-nanometer roughness. Substrate compatibility must be verified for thermal expansion mismatch and adhesion strength during subsequent processing.

• Surface Integrity Constraint: The Ra ≤ 1 nm roughness specification imposes strict limits on contact pressure and particulate exposure during handling and storage.
• Substrate Matching Constraint: Thermal expansion coefficient differences between the film stack and substrate must be evaluated to prevent delamination during annealing or deposition cycles.

This procedure outlines the steps for safely handling and preparing the platinum-coated substrate for integration into a vacuum deposition or characterization system. Proper technique prevents surface contamination and mechanical damage to the thin film stack.

Required Equipment: Cleanroom-grade tweezers with PTFE tips, Nitrogen gun with 0.1 µm filter, Anti-static cleanroom wipes

1. Inspect packaging integrity
   Verify the vacuum-sealed pouch is intact and the substrate is free from visible cracks or edge chips before opening.
2. Remove substrate from packaging
   Grasp the substrate edge with cleanroom tweezers and lift it vertically from the carrier without sliding the coated surface against any surface.
3. Clean the substrate surface
   Direct a gentle stream of filtered nitrogen at a 45-degree angle across the coated side to dislodge any loose particles.
4. Mount substrate in holder
   Secure the substrate in a spring-loaded or vacuum-compatible holder, ensuring the coated side faces the intended deposition or measurement direction.
5. Confirm substrate compatibility
   Verify that the substrate material and thickness match the thermal and mechanical requirements of the target process chamber.

This 2 inch single-sided platinum-coated substrate with a Ti 30 nm / Pt 100 nm film stack on silicon, glass, quartz, or sapphire provides a research-grade platform with ≤1 nm roughness and ≥99.999% purity, primarily suited for electrochemical and sensor applications requiring ultra-smooth, high-purity conductive surfaces.

Positive

• Ultra-low surface roughness: Film roughness Ra ≤ 1 nm ensures a highly smooth surface, reducing background signal in sensitive electrochemical or spectroscopic measurements and improving film uniformity for subsequent deposition processes.
• High-purity platinum film: Platinum purity ≥ 99.999% minimizes contaminant-related artifacts in catalytic or sensing experiments, enabling reliable and reproducible surface chemistry studies.

Trade-offs

• Pre-order specification confirmation required: Substrate type, thickness, and coating process must be confirmed before quotation, introducing lead-time delays and requiring upfront specification matching to intended experimental conditions.
• Single-sided coating limits integration: The single-sided coating configuration restricts use to applications requiring only one conductive face, and the exposed backside (bare substrate) may introduce unintended electrical or chemical interactions if not properly masked.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).