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N type Monocrystalline Silicon Wafer – 6 inch (150 mm) <100> Single-Side Polished
Product Type: Silicon wafer
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the geometric tolerance specifications (TTV, BOW, WARP) for this 6-inch N-type silicon wafer, and how do they impact device fabrication?
This wafer has a typical thickness of 625 ± 25 µm with TTV <10 µm, BOW <15 µm, and WARP <20 µm. These tight tolerances minimize wafer deformation during processing, enhancing lithography alignment and reducing yield loss in photolithography and etching steps.
Is this single-side polished wafer suitable for processes requiring double-side polished surfaces?
This specific product is single-side polished (SSP) with a front-side roughness of Ra <0.5 nm and an etched back side. It is not suitable for double-side processing such as mirror-polished backside contacts or double-sided lithography without additional backside polishing. For double-side polished (DSP) requirements, a different product configuration must be selected, as indicated by the available SSP/DSP option.
This 6-inch N-type monocrystalline silicon wafer with <100> orientation and single-side polished finish offers tight geometric tolerances (TTV <10 um, BOW <15 um, WARP <20 um) and low front-side roughness (Ra <0.5 nm), making it suitable for high-resolution photolithography and device fabrication. The high-purity 6N material and selectable resistivity provide flexibility, but careful handling of the polished surface is required.
Positive
- High-purity 6N silicon material: The wafer is available in 6N (99.9999%) monocrystalline silicon via CZ or FZ methods, ensuring minimal impurity levels critical for sensitive semiconductor and research applications.
- Tight geometric tolerances: Specified TTV <10 um, BOW <15 um, WARP <20 um, and front-side roughness Ra <0.5 nm provide excellent uniformity for photolithography, thin-film deposition, and device yield.
Trade-offs
- Polished surface handling sensitivity: The single-side polished front surface with Ra <0.5 nm is highly susceptible to scratches, particulate contamination, and chemical damage, requiring cleanroom handling and storage protocols.
- Resistivity selection required at order: The wafer offers multiple resistivity ranges (e.g., 0.001-0.005 ohm.cm to >10K ohm.cm), meaning the buyer must pre-specify the exact resistivity to match their application, adding a specification step.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
