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N-Type Silicon Wafer 4 in DSP 500μm ATOMFAIR®

N-Type Silicon Wafer 4 in DSP 500μm ATOMFAIR®

$23.90

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

N-type 4 inch (100 mm) silicon wafer, DSP, 500 ±25 μm thick with Ra <0.5 nm surfaces, TTV <10 μm and WARP <15 μm for MEMS research. Order now.

SKU: AF-WF-S-SILI-04IN-S086
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N type Monocrystalline Silicon Wafer – 4 inch (100 mm) <100> Double-Side Polished
Product Type: Silicon wafer
Research-grade laboratory product
Product Overview

4 inch (100 mm) monocrystalline silicon wafer is supplied in N type configuration with <100> orientation, 500 +/- 25 um typical thickness and double-side polished finish.

The wafer geometry includes <10 um TTV, <10 um BOW, <15 um WARP and front-side roughness of Ra <0.5 nm.
Performance Features
  • 6N monocrystalline silicon CZ / FZ material is available for this wafer configuration.
  • Doping, orientation and polishing are shown as clear selection specifications.
  • Diameter-specific thickness, TTV, BOW and WARP values are provided for product comparison.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-SIW-N4100DSP
Material 6N monocrystalline silicon CZ / FZ
Type / Doping N type
Resistivity Selectable values include 0.001-0.005 ohm.cm, 1-10 ohm.cm, >10 ohm.cm, >5K ohm.cm and >10K ohm.cm
Wafer Orientation <100>
Diameter 4 inch (100 mm)
Typical Thickness 500 +/- 25 um
Polish Double-Side Polished
Front-Side Roughness Ra <0.5 nm
Back Side Ra <0.5 nm
TTV <10 um
BOW <10 um
WARP <15 um
Wafer Specification: Select 4 inch (100 mm), N type, <100>, Double-Side Polished and final resistivity requirement.
Surface Finish: Select SSP or DSP surface requirement and backside condition for the selected silicon wafer.
Ordering Details: Share the selected model, configuration, quantity and any thickness or packaging preference.
PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

What is the typical thickness tolerance and flatness specification for the 4-inch N-type <100> double-side polished silicon wafer?

The wafer has a typical thickness of 500 +/- 25 um with a TTV of <10 um, BOW of <10 um, and WARP of <15 um. Front-side and back-side roughness are both Ra <0.5 nm, ensuring high flatness for photolithography and thin-film deposition processes.

Which resistivity ranges are available for this N-type CZ/FZ monocrystalline silicon wafer?

Selectable resistivity values include 0.001-0.005 ohm.cm, 1-10 ohm.cm, >10 ohm.cm, >5K ohm.cm, and >10K ohm.cm. This range supports applications from high-conductivity power devices to high-resistivity RF and detector-grade substrates.

What surface finish options are available for this 4-inch double-side polished silicon wafer?

The wafer is supplied with a double-side polished (DSP) finish as standard, with front-side and back-side roughness both Ra <0.5 nm. Single-side polished (SSP) options are also available upon request, allowing customization for specific backside contact or handling requirements.

This 4-inch N-type monocrystalline silicon wafer with <100> orientation and double-side polished finish provides a front-side roughness of Ra <0.5 nm and selectable resistivity from 0.001 ohm.cm to >10K ohm.cm, making it suitable for research-grade applications requiring precise surface quality and electrical properties.

Positive

  • Double-side polished with low roughness: Both front and back sides have Ra <0.5 nm, providing a uniformly smooth surface suitable for epitaxial growth or multilayer deposition.
  • Wide resistivity selection range: Resistivity options from 0.001–0.005 ohm.cm to >10K ohm.cm allow tailoring of electrical properties for specific device requirements.

Trade-offs

  • Fixed diameter and thickness tolerance: The 4-inch diameter and 500±25 µm thickness limit compatibility with tools designed for other wafer sizes, and the ±25 µm tolerance may require sorting for critical thickness-dependent processes.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

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