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Copper Oxide (Cu2O) Evaporation Material, Powder, 99.5%, 80 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The material imposes specific constraints on deposition source hardware, particle size handling, and process parameters. Purity and thermal properties must be matched to the evaporation method and film requirements.
- Evaporation Source Hardware: Compatible with e-beam hearth using graphite, Al2O3, or BN liner, or W/Mo/Ta boat; sheet2 hardware includes Tantalum, Graphite, and Al2O3.
- Particle Size and Form: The 80 nm powder form is specified for source loading and evaporation uniformity.
- Thermal and Density Parameters: Melting point of 1235°C and density of 6 g/cm³ influence power requirements and deposition rate.
- Purity and Process Matching: 99.5% purity ensures consistent film stoichiometry; e-beam evaporation is preferred, thermal evaporation requires RFQ.
What are the recommended evaporation methods for Cu2O powder and why is E-beam preferred over thermal evaporation?
E-beam evaporation is the preferred method for Cu2O powder, as it achieves good performance using an E-beam hearth with graphite, Al2O3, or BN liner, or a W/Mo/Ta boat. Thermal evaporation is available by RFQ only, indicating that E-beam provides more reliable and consistent results for this material. The melting point of 1235°C and density of 6 g/cm³ are compatible with E-beam evaporation conditions.
What deposition source hardware is compatible with Cu2O evaporation material?
Cu2O evaporation material is compatible with E-beam hearths using graphite, Al2O3, or BN liners, as well as tungsten, molybdenum, or tantalum boats. Sheet2 hardware made of tantalum or graphite is also specified. Buyers should confirm deposition source geometry and hardware compatibility before ordering, as detailed in the product procurement check.
What is the melting point of Cu2O and how does it affect evaporation infrastructure requirements?
The melting point of Cu2O is 1235°C, which necessitates high-temperature evaporation infrastructure such as an E-beam hearth with refractory liners (graphite, Al2O3, BN) or suitable boats (W, Mo, Ta). This temperature is achievable with standard E-beam systems, but thermal evaporation may require additional heat management. The Z-ratio of 1.00 indicates good acoustic impedance matching for quartz crystal monitoring.
Copper Oxide (Cu2O) evaporation material in powder form with 99.5% purity and 80 nm particle size, designed for e-beam evaporation with good performance across multiple liner materials; thermal evaporation available only by RFQ, requiring careful source matching.
Positive
- High-purity Cu2O evaporation material: 99.5% purity and 80 nm particle size ensure consistent film stoichiometry and controlled deposition rates for thin-film applications.
- E-beam evaporation compatibility: Optimized for e-beam evaporation with good performance using graphite/Al2O3/BN liners or W/Mo/Ta boats, providing reliable source loading.
Trade-offs
- Thermal evaporation requires RFQ: Thermal evaporation is not a standard option and must be requested via quotation, limiting process flexibility for users without e-beam capability.
- Deposition-source compatibility must be verified: Buyers must confirm that the powder form and particle size match their specific evaporation source geometry and liner material to avoid process issues.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
