Copper (Cu) Evaporation Wire 99.999% 1.0 mm ATOMFAIR®

Price range: $210.00 through $1,500.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade 99.999% Cu evaporation wire, 1.0 mm dia., for thermal/resistive deposition using W/Mo/Ta lab sources; 25g-1kg packs. Order now.

Copper (Cu) Evaporation Material, Wire, 99.999%, Dia. 1.0 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
Product Overview

Copper (Cu) Evaporation Material, Wire, 99.999%, Dia. 1.0 mm is a research-grade pure metal evaporation material supplied as Wire with 99.999% material specification and Wire Dia. 1.0 mm size range for vacuum thin-film deposition workflows.

This evaporation material is prepared for laboratory procurement where material identity, purity, physical form, pack size and deposition hardware must be confirmed before ordering. The listed configuration supports selection for Thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat.

Available pack sizes are 25g / 100g / 500g / 1kg. Buyers should confirm deposition source geometry, required quantity, certificate requirements and shipment conditions before quotation.

Performance Features
  • Defined material identity: Copper (Cu) for clear procurement and deposition-process matching.
  • Specified physical form: Wire with Wire Dia. 1.0 mm sizing to support source loading and evaporation review.
  • Purity or composition listed as 99.999%, allowing comparison between standard, high-purity and RFQ-controlled grades.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-CUWIR-5N1P0MM
Material Copper
Formula Cu
Product Type Pure Metal Evaporation Material
Form Wire
Purity / Composition 99.999%
Particle Size / Dimensions Wire Dia. 1.0 mm
Minimum Order Quantity 25g
Available Pack Sizes 25g / 100g / 500g / 1kg
Indicative Price Tiers 25g: USD 210; 100g: USD 440; 500g: USD 1150; 1kg: USD 1500
Evaporation Source W/Mo/Ta filament, basket, coil, or boat
Evaporation Method Thermal/resistive evaporation
Melting Point 1,083
Density 8.92
Z-Ratio 0.437
PROCUREMENT CHECK: Confirm model, purity, form, size range, pack size and deposition-source compatibility before quotation.
DOCUMENTATION REVIEW: Certificate, safety data sheet, shipment condition and export requirements can be reviewed against laboratory use requirements.
APPLICATION MATCHING: Evaporation source hardware and process route should be matched to material behavior, melting point and film requirements.
INQUIRY NOTE: Include the required model, purity, form, size range and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Copper wire (99.999% purity, 1.0 mm diameter) is designed for thermal resistive evaporation in vacuum thin-film deposition. The material requires a compatible evaporation source made of W, Mo, or Ta and process parameters matched to its melting point (1083°C) and Z-ratio (0.437).

  • Evaporation Source Compatibility: Confirm the evaporation source material is W, Mo, or Ta as specified for filament, basket, coil, or boat configurations.
  • Physical Form Verification: Verify the wire diameter (1.0 mm) is compatible with the source holder geometry and loading mechanism.
  • Purity and Quality Check: Ensure the 99.999% purity grade meets the required film properties and contamination limits.
  • Process Parameter Calibration: Use the melting point (1083°C) and Z-ratio (0.437) to calibrate evaporation power and rate for consistent film deposition.

How does the 99.999% purity of this copper wire affect thin-film deposition compared to lower purity grades?

A purity of 99.999% minimizes contamination in deposited films, which is critical for applications requiring high electrical conductivity or optical performance. The product specification explicitly lists this purity level for comparison between standard, high-purity, and RFQ-controlled grades, indicating that lower purity may introduce defects or alter film resistivity.

Is this copper wire compatible with e-beam evaporation or only thermal/resistive methods?

This copper wire is explicitly specified for thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat sources. E-beam evaporation is not listed as a supported method, and the wire form and diameter may not be optimized for e-beam applications. Users should verify compatibility with their specific deposition hardware before ordering.

Why is the wire diameter specified as 1.0 mm, and how does it affect loading into evaporation sources?

The 1.0 mm diameter is chosen to fit standard filament, basket, coil, or boat configurations for thermal evaporation. This specific dimension ensures consistent feeding and uniform evaporation rates, as indicated by the product's form (wire) and size range specification. Loading is straightforward for sources with compatible wire-feed mechanisms.

Copper evaporation wire with 99.999% purity and 1.0 mm diameter, suitable for thermal resistive evaporation using W/Mo/Ta sources. The specified Z-ratio of 0.437 and melting point of 1083°C define critical process parameters for reproducible thin-film deposition.

Positive

  • High-purity 99.999% copper: Trace metal impurities are minimized, enabling low-contamination films for sensitive electronic or optical applications.
  • Precisely defined wire diameter: The 1.0 mm wire form ensures consistent loading geometry and predictable evaporation behavior across thermal resistive sources.

Trade-offs

  • High melting point requires robust source: The 1083°C melting point mandates use of high-temperature W/Mo/Ta filaments, baskets, or boats to avoid source degradation or incomplete evaporation.
  • Z-ratio affects thickness monitoring: A Z-ratio of 0.437 must be entered into quartz crystal microbalance controllers to maintain accurate film thickness readings during deposition.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

25g, 100g, 500g, 1kg

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