Aluminum Nitride Ceramic Substrate, 20 mm x 20 mm x 0.38 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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How does the thermal performance of this 20 mm x 20 mm x 0.38 mm AlN substrate compare with alumina for power dissipation?
This aluminum nitride substrate has thermal conductivity above 170 W/(m·K) at 25 °C, which is about 7-10 times higher than alumina ceramic. Its thermal expansion is also close to silicon, making it suited for power module and electronic component heat-dissipation workflows.
What electrical insulation and dielectric properties does this AlN ceramic substrate provide?
The substrate provides a DC breakdown voltage of at least 15 kV/mm, with low dielectric constant and low dielectric loss for insulating substrate use. The material is non-toxic and offers high-temperature and chemical corrosion resistance.
What mechanical and handling properties should be considered when working with a 0.38 mm thick aluminum nitride ceramic substrate?
The specified mechanical values are flexural strength >400 MPa, fracture toughness 3.0 MPa·√m, Vickers hardness 11 GPa, and Young’s modulus 320 GPa, with surface roughness Ra of 0.2-0.3 µm. Because this is a 0.38 mm thick ceramic piece, size tolerance, thickness requirement, material grade, surface finish, and package format should be checked before use.
This 20 mm x 20 mm x 0.38 mm aluminum nitride ceramic substrate in a pack of 10 offers thermal conductivity >170 W/(m·K), approximately 7–10 times higher than alumina, with a thermal expansion coefficient close to silicon, making it suitable for power module and electronic component heat-dissipation applications. The as-fired surface roughness of 0.2–0.3 μm and high flexural strength >400 MPa provide a mechanically robust insulating substrate, but the thin 0.38 mm thickness requires careful handling to avoid fracture during processing.
Positive
- High thermal conductivity, 7–10× alumina: Thermal conductivity >170 W/(m·K) at 25 °C enables efficient heat spreading in power electronics and LED modules, significantly outperforming alumina ceramics for thermal management.
- CTE matched to silicon: Thermal expansion coefficient close to silicon reduces thermomechanical stress in power modules and electronic component assemblies, improving reliability under thermal cycling.
Trade-offs
- Thin substrate requires careful handling: At 0.38 mm thickness, the substrate is mechanically fragile and prone to fracture during handling, cutting, or mounting without proper support or fixturing.
- As-fired surface may need post-processing: Surface roughness Ra of 0.2–0.3 μm is typical for as-fired AlN; applications requiring metallization, thin-film deposition, or low-loss RF performance may require additional polishing or surface treatment.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
