Aluminum Nitride Ceramic Substrate, 120 mm x 120 mm x 0.5 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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How does the thermal conductivity of this aluminum nitride substrate compare to standard alumina substrates, and why is that significant for high-power electronics?
This AlN substrate provides thermal conductivity above 170 W/(m·K) at 25°C, which is approximately 7 to 10 times higher than alumina ceramic. This enables efficient heat dissipation in high-power modules, reducing operating temperatures and improving long-term reliability.
How does the thermal expansion coefficient of this AlN substrate align with silicon for power module assembly?
The thermal expansion of this aluminum nitride ceramic is close to that of silicon, minimizing thermal stress during temperature cycling. This compatibility is critical for reliable bonding in power modules and electronic component workflows.
What mechanical strength does this 0.5 mm thick AlN substrate provide for handling and processing?
The substrate has a flexural strength greater than 400 MPa and a Vickers hardness of 11 GPa, providing sufficient mechanical robustness for typical handling, dicing, and die-attach processes while maintaining dimensional stability at 120 mm x 120 mm x 0.5 mm.
This 120 mm x 120 mm x 0.5 mm aluminum nitride ceramic substrate delivers thermal conductivity above 170 W/(m·K), approximately 7-10 times higher than alumina, with a thermal expansion coefficient close to silicon, making it well-suited for high-power electronic heat dissipation and power module applications.
Positive
- Superior thermal conductivity: With >170 W/(m·K) at 25 °C, conductivity is 7-10 times higher than alumina ceramic, enabling efficient heat dissipation in power electronics and LED substrates.
- CTE match to silicon: Thermal expansion coefficient close to silicon reduces thermomechanical stress during thermal cycling, improving reliability for direct component mounting.
Trade-offs
- Surface finish requirements: As-sintered surface roughness Ra of 0.2-0.3 µm may require additional polishing for metallization or thin-film deposition, adding processing steps and cost.
- Brittle ceramic handling: With flexural strength >400 MPa and fracture toughness of 3.0 MPa·√m, the substrate is susceptible to edge chipping or cracking under mechanical or thermal shock, requiring careful handling and controlled mounting processes.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
