96% Alumina Ceramic Substrate, 40 mm x 40 mm x 1 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What is the surface roughness of the 96% alumina ceramic substrate and how does it affect metallization adhesion?
The surface roughness is specified as Ra 0.15–0.30 μm. This as-fired finish is typical for 96% alumina ceramic substrates used in electronic applications and provides adequate surface texture for standard thick-film and thin-film metallization processes.
What is the dielectric strength of this 1 mm thick 96% alumina substrate?
The breakdown voltage is ≥15 kV/mm. For a 1 mm thickness, the minimum dielectric strength is 15 kV, making this substrate suitable for high-voltage insulation in compact electronic assemblies.
What is the flexural strength of the 96% alumina ceramic substrate and how does it ensure mechanical reliability?
The flexural strength is >350 MPa. This high mechanical strength provides robust handling and processing resistance, reducing the risk of fracture during cutting, clamping, or thermal cycling in laboratory and production environments.
96% alumina ceramic substrate offering >350 MPa flexural strength, 14 GPa hardness, and >24 W/(m·K) thermal conductivity with Ra 0.15–0.30 μm surface finish; suited for high-voltage insulation and thermal management in laboratory prototypes.
Positive
- High mechanical strength and thermal conductivity: Flexural strength >350 MPa and thermal conductivity >24 W/(m·K) support structural integrity and heat dissipation in high-power or high-temperature laboratory setups.
- Low dielectric loss for RF applications: Low dielectric constant and dielectric loss combined with ≥15 kV/mm breakdown voltage provide reliable electrical insulation for RF and high-voltage test platforms.
Trade-offs
- Brittle under mechanical shock: As a dense ceramic (≥3.70 g/cm³, 14 GPa hardness), the substrate is susceptible to cracking under localized impact or bending stress, requiring careful handling during assembly.
- Surface roughness limits thin-film adhesion: Ra 0.15–0.30 μm surface finish may necessitate additional polishing or planarization for advanced thin-film or metallization processes requiring sub-micron smoothness.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
