96% Alumina Ceramic Substrate, 20 mm x 20 mm x 1 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What is the significance of the thermal conductivity and breakdown voltage specifications for this 96% alumina substrate in power electronics applications?
The thermal conductivity above 24 W/(m·K) enables efficient heat dissipation from power devices, while the breakdown voltage of at least 15 kV/mm ensures robust electrical isolation. This combination supports high-voltage, high-power-density designs. The 96% alumina composition provides a cost-effective balance of thermal and electrical properties for substrate applications.
What surface roughness is specified for this 96% alumina ceramic substrate, and how does it affect metallization readiness?
The surface roughness is Ra 0.15–0.30 µm, as-fired. This range is suitable for standard metallization processes. For applications requiring a polished or coated surface, custom options are available upon request, as noted in the product configuration options.
What mechanical properties should be considered when handling or dicing this 96% alumina substrate?
With a flexural strength exceeding 350 MPa and a Vickers hardness of 14 GPa, the substrate is strong and wear-resistant but brittle. Diamond tooling is recommended for dicing or cutting to avoid edge chipping. Careful handling is required despite the high mechanical strength due to the inherent brittleness of ceramic materials.
This 96% alumina ceramic substrate (20 mm x 20 mm x 1 mm, pack of 50) offers a balance of high mechanical strength, electrical insulation, and thermal conductivity suitable for laboratory prototyping or thin-film deposition substrates, though its as-fired surface roughness and brittle nature impose handling and post-processing constraints.
Positive
- High flexural strength and hardness: Flexural strength greater than 350 MPa and Vickers hardness of 14 GPa provide robust mechanical integrity for substrate handling and device fabrication steps, reducing risk of fracture under moderate loads.
- Electrical insulation and thermal conductivity: Breakdown voltage of 15 kV/mm ensures reliable electrical isolation in high-voltage or thin-film device applications, while thermal conductivity greater than 24 W/(m·K) aids heat dissipation from active components.
Trade-offs
- As-fired surface roughness: Surface roughness Ra of 0.15-0.30 μm may require polishing for applications demanding ultra-smooth interfaces, such as epitaxial growth or critical thin-film adhesion.
- Brittle ceramic handling constraints: Despite high flexural strength, the ceramic is brittle and may chip or crack under point-load stress or rapid thermal cycling, necessitating careful handling and controlled processing conditions.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
