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Tantalum Nitride (TaN) Evaporation Material, Pellets, 99.9%, 35 µm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Why is e-beam evaporation preferred over thermal evaporation for TaN pellets with a melting point of 3360°C?
E-beam evaporation is preferred due to the high melting point of 3360°C, which makes thermal evaporation challenging. The specified Z-ratio of 1.00 also supports e-beam process compatibility. Thermal feasibility can be evaluated via RFQ, but e-beam is the recommended method for this TaN material.
What liner or crucible materials are compatible with TaN pellets at 3360°C during e-beam evaporation?
The product requires an e-beam hearth with a compatible liner, and a high-temperature crucible can be quoted by RFQ. The specific liner material is not stated in the product description, so buyers should consult the technical sales team to confirm compatibility with their deposition system.
What documentation and procurement checks are required before ordering TaN evaporation material?
Buyers must confirm the model, purity (99.9%), form (pellets), size range (35 µm), pack size, and deposition-source compatibility before quotation. Documentation includes certificate of analysis, safety data sheet, and shipment condition review to ensure compliance with laboratory use requirements.
Tantalum Nitride (TaN) pellets at 99.9% purity and 35 µm size are evaluated for E-beam evaporation, offering a high melting point of 3,360 °C and density of 16.3 g/cm³, but requiring careful source hardware matching and thermal feasibility confirmation for non-standard deposition routes.
Positive
- High-purity 99.9% TaN pellets: The 99.9% purity and defined 35 µm pellet form enable consistent evaporation behavior and film stoichiometry for research-grade thin-film deposition, supporting reproducible results in E-beam processes.
- High melting point and density: With a melting point of 3,360 °C and density of 16.3 g/cm³, this material provides thermal stability and dense film formation, advantageous for barrier or hard-coating applications in semiconductor or photonics devices.
Trade-offs
- E-beam preferred; thermal limited: Evaporation is optimized for E-beam hearths with compatible liners; thermal evaporation requires RFQ feasibility review, adding process validation steps for labs without E-beam capability.
- High-temperature crucible needed: The 3,360 °C melting point necessitates high-temperature crucibles by RFQ, increasing hardware procurement complexity and potential lead time for deposition system integration.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
