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Copper Oxide (Cu2O) Evaporation Material, Powder, 99.995%, < 77 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This material requires specific deposition source hardware and process matching. Users must confirm compatibility with e-beam or thermal evaporation systems and handle nanopowder to avoid contamination and agglomeration.
- Source Hardware Compatibility: Deposition source hardware must be matched to material behavior, melting point, and film requirements.
- Evaporation Method Preference: E-beam evaporation is preferred; thermal evaporation requires RFQ approval.
- Liner Material Compatibility: Compatible liner materials include graphite, Al2O3, BN, W, Mo, and Ta.
- Nanopowder Handling: Particle size below 77 nm requires careful handling to prevent agglomeration and airborne contamination.
- Pre-Order Verification: Confirm deposition-source compatibility, model, purity, form, and size range before quotation.
What evaporation methods are compatible with this Cu2O powder?
E-beam evaporation is preferred, with good performance using an e-beam hearth with a graphite/Al2O3/BN liner or W/Mo/Ta boat. Thermal evaporation is available by RFQ (request for quotation). The technical specifications also list tantalum, graphite, and Al2O3 as compatible sheet hardware materials.
What are the purity and particle size specifications for this Copper Oxide (Cu2O) evaporation material?
The material is specified as 99.995% purity and supplied as powder with a particle size of < 77 nm. These parameters are critical for matching deposition process requirements and ensuring consistent thin-film quality.
What pack sizes are available for this Cu2O evaporation material?
Available pack sizes are 25g, 100g, 500g, and 1kg, with a minimum order quantity of 25g. Indicative price tiers are provided per pack size, and buyers should confirm deposition source geometry and quantity requirements before ordering.
Copper Oxide (Cu2O) evaporation material, powder form with 99.995% purity and <77 nm particle size, offers high-purity feedstock for thin-film deposition with good E-beam evaporation performance, but requires careful source-hardware matching and is not optimized for direct thermal evaporation without RFQ.
Positive
- 99.995% Purity: High purity specification (99.995%) enables consistent film stoichiometry and reduces contamination risk in sensitive thin-film applications.
- Nanoscale Particle Size (<77 nm): Sub-77 nm powder size promotes uniform evaporation rates and improved source loading behavior in E-beam deposition systems.
Trade-offs
- Source Hardware Compatibility Required: Optimal performance requires E-beam hearth with graphite/Al2O3/BN liner or W/Mo/Ta boat; thermal evaporation is only available by RFQ, limiting direct process flexibility.
- Pre-Deposition Procurement Checks: Buyers must confirm deposition source geometry, pack size, certificate requirements, and shipment conditions before order, adding lead-time for laboratory planning.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
