Copper Oxide Cu2O Evaporation Powder 99.95% 16 nm ATOMFAIR®

Price range: $460.00 through $3,600.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade Cu2O evaporation powder, 99.95% purity and 16 nm particle size, for E-beam thin-film deposition; 25g-1kg packs. Order now.

Copper Oxide (Cu2O) Evaporation Material, Powder, 99.95%, 16 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
Product Overview

Copper Oxide (Cu2O) Evaporation Material, Powder, 99.95%, 16 nm is a research-grade compound evaporation material supplied as Powder with 99.95% material specification and Powder 16 nm size range for vacuum thin-film deposition workflows.

This evaporation material is prepared for laboratory procurement where material identity, purity, physical form, pack size and deposition hardware must be confirmed before ordering. The listed configuration supports selection for E-beam evaporation preferred; thermal evaporation by RFQ | E-beam performance: Good using E-beam hearth with graphite/Al2O3/BN liner or W/Mo/Ta boat | Sheet2 hardware: Tantalum,Graphite | Ta | – | – | Al2O3.

Available pack sizes are 25g / 100g / 500g / 1kg. Buyers should confirm deposition source geometry, required quantity, certificate requirements and shipment conditions before quotation.

Performance Features
  • Defined material identity: Copper Oxide (Cu2O) for clear procurement and deposition-process matching.
  • Specified physical form: Powder with Powder 16 nm sizing to support source loading and evaporation review.
  • Purity or composition listed as 99.95%, allowing comparison between standard, high-purity and RFQ-controlled grades.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-CU2OPWD-999516NM
Material Copper Oxide
Formula Cu2O
Product Type Compound Evaporation Material
Form Powder
Purity / Composition 99.95%
Particle Size / Dimensions Powder 16 nm
Minimum Order Quantity 25g
Available Pack Sizes 25g / 100g / 500g / 1kg
Indicative Price Tiers 25g: USD 460; 100g: USD 1000; 500g: USD 2700; 1kg: USD 3600
Evaporation Source E-beam hearth with graphite/Al2O3/BN liner or W/Mo/Ta boat | Sheet2 hardware: Tantalum,Graphite | Ta | – | – | Al2O3
Evaporation Method E-beam evaporation preferred; thermal evaporation by RFQ | E-beam performance: Good
Melting Point 1,235
Density 6
Z-Ratio **1.00
PROCUREMENT CHECK: Confirm model, purity, form, size range, pack size and deposition-source compatibility before quotation.
DOCUMENTATION REVIEW: Certificate, safety data sheet, shipment condition and export requirements can be reviewed against laboratory use requirements.
APPLICATION MATCHING: Evaporation source hardware and process route should be matched to material behavior, melting point and film requirements.
INQUIRY NOTE: Include the required model, purity, form, size range and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This material requires specific evaporation source hardware and liner materials to avoid contamination. The fine powder form and melting point of 1,235 °C demand careful matching of deposition parameters to ensure consistent film quality.

  • Evaporation Source Compatibility: Use an e-beam hearth with graphite, Al2O3, or BN liner, or a W/Mo/Ta boat, to prevent chemical reaction with the source.
  • Powder Handling: Handle the 16 nm powder in a controlled environment to minimize airborne dispersion and ensure uniform loading into the source.
  • Melting Point Consideration: Match the 1,235 °C melting point to the deposition source's power capacity and temperature monitoring system.
  • Evaporation Method Preference: E-beam evaporation is recommended; thermal evaporation requires a quotation and may yield different deposition rates.

How does the 99.95% purity of this Cu2O evaporation material affect thin-film quality?

The 99.95% purity specification minimizes metal and oxide impurity levels, reducing defect density and improving film stoichiometry in optical or electronic applications. This grade allows direct comparison with standard or higher-purity materials by referencing the listed purity value in the technical specifications.

What evaporation hardware is compatible with Cu2O powder for reliable deposition?

Cu2O evaporation material is preferred for e-beam evaporation using a hearth lined with graphite, Al2O3, or BN, or using a W/Mo/Ta boat. Thermal evaporation is available by RFQ. The source explicitly lists these hardware options and states that e-beam performance is good with the recommended liners and boats.

What is the melting point of Cu2O and how does it influence deposition process parameters?

Cu2O has a melting point of 1,235 °C as stated in the technical specifications. This temperature dictates the choice of crucible or boat material to withstand thermal stress and avoid contamination, and determines the power settings required for stable evaporation in e-beam or thermal processes.

Copper Oxide (Cu2O) evaporation material (99.95% purity, 16 nm powder) is evaluated for vacuum thin-film deposition. It offers good e-beam performance with graphite/Al2O3/BN liners or W/Mo/Ta boats, but thermal evaporation requires RFQ and hardware compatibility must be verified.

Positive

  • High purity and fine particle size: 99.95% purity and 16 nm particle size enable controlled, reproducible thin-film deposition with consistent material flux.
  • Good e-beam performance with multiple liner options: Compatible with graphite, Al2O3, BN liners and W/Mo/Ta boats, providing flexibility for various e-beam evaporation source configurations.

Trade-offs

  • Limited evaporation method flexibility: Thermal evaporation is not standard and requires RFQ, adding procurement lead time and process verification effort.
  • Hardware matching required for optimal performance: Evaporation source geometry and liner material must be matched to the material's melting point (1235°C) and density (6 g/cm³) to achieve stable deposition rates.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

25g, 100g, 500g, 1kg

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