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Tin (Sn) Evaporation Material, Wire, 99.999%, Dia. 1.0 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The material requires thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat sources. Process parameters must be calibrated to the material's melting point of 232°C and Z-ratio of 0.724.
- Evaporation Method: This material requires thermal/resistive evaporation using a W/Mo/Ta filament, basket, coil, or boat source.
- Source Geometry Compatibility: The wire diameter of 1.0 mm must be compatible with the selected evaporation source geometry for proper loading.
- Process Parameter Calibration: The melting point of 232°C and Z-ratio of 0.724 must be used to calibrate deposition parameters.
- Process and Hardware Matching: Evaporation source hardware and process route must be matched to the material's melting point and film requirements.
What is the significance of the Z-ratio (0.724) for Tin (Sn) wire in thermal evaporation processes?
The Z-ratio of 0.724 is a material property that affects the calibration of film thickness monitors during thermal evaporation. This value is provided in the product specifications to enable accurate deposition rate control when using the 99.999% pure Tin (Sn) wire.
Which filament or boat materials are compatible with Tin (Sn) evaporation wire of diameter 1.0 mm?
The Tin (Sn) evaporation wire is compatible with tungsten (W), molybdenum (Mo), or tantalum (Ta) filaments, baskets, coils, or boats, as specified in the product description. These materials are suitable for thermal/resistive evaporation of the 1.0 mm diameter wire at its melting point of 232°C.
How does the low melting point (232°C) of Tin (Sn) wire influence the thermal evaporation parameters and source selection?
Tin (Sn) has a melting point of 232°C, which is relatively low compared to many other evaporation materials. This allows for evaporation at lower power settings, reducing thermal stress on the source and enabling the use of standard resistive heating sources such as W, Mo, or Ta boats. The density of 7.28 g/cm³ and Z-ratio of 0.724 should also be considered for process control.
Tin (Sn) evaporation material supplied as 1.0 mm diameter wire with 99.999% purity, designed for thermal/resistive evaporation using W/Mo/Ta sources. The low melting point (232°C) and Z-ratio of 0.724 require careful process control and crystal monitor calibration for consistent film deposition.
Positive
- High purity 99.999%: Minimizes contamination in deposited thin films, critical for research-grade coatings and electronic device fabrication.
- Wire form with 1.0 mm diameter: Facilitates consistent loading into W/Mo/Ta filament, basket, coil, or boat sources for thermal evaporation processes.
Trade-offs
- Low melting point (232°C): Requires precise power control to avoid spitting or uneven evaporation, especially in high-rate deposition runs.
- Z-ratio of 0.724: Necessitates calibration of quartz crystal microbalance thickness monitors to maintain accurate film thickness control.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
