|
Copper (Cu) Evaporation Material, Wire, 99.999%, Dia. 0.5 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
This copper wire evaporation material is designed for thermal/resistive vacuum deposition using W/Mo/Ta filament, basket, coil, or boat sources. The material requires careful matching of wire diameter to source geometry and consideration of its melting point (1083°C), density (8.92 g/cm³), and Z-ratio (0.437) for process control.
- Evaporation source compatibility: Evaporation source hardware must be compatible with W/Mo/Ta filament, basket, coil, or boat designs.
- Wire diameter constraint: The wire diameter of 0.5 mm constrains the physical loading and feed mechanism of the evaporation source.
- Melting point constraint: The material's melting point of 1083°C determines the required power and temperature profile for thermal evaporation.
- Z-ratio constraint: The Z-ratio of 0.437 must be used for accurate quartz crystal microbalance thickness monitoring during deposition.
- Purity requirement: A purity of 99.999% is required to minimize contamination in thin-film applications.
How does the 99.999% purity of this copper wire affect thin-film properties in thermal evaporation?
The 99.999% (5N) purity minimizes contaminant incorporation during thermal evaporation, which is critical for achieving low-resistivity, high-conductivity films in semiconductor and optoelectronic applications. This specification directly supports high-vacuum deposition where oxygen, carbon, and metal impurities can degrade film adhesion, grain structure, and electrical performance.
Can this 0.5 mm copper wire be used in electron beam evaporation, or is it restricted to thermal sources?
The product is explicitly specified for thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat geometries. E-beam evaporation typically requires pellet or slug forms to withstand high localized electron flux, so this wire form is not recommended for e-beam sources without prior conversion. The 0.5 mm diameter is optimized for consistent feeding and melting in thermal boats and coils.
Why is the Z-ratio of 0.437 provided for this copper wire, and how is it used in deposition rate monitoring?
The Z-ratio of 0.437 is an acoustic impedance factor used to calibrate quartz crystal microbalance (QCM) thickness monitors for copper films. Incorrect Z-ratio values cause systematic errors in measured film thickness and deposition rate. This value, specific to copper at the stated density (8.92 g/cm³), should be entered into the deposition controller before running the process to ensure accurate real-time thickness readouts.
Atomfair's Copper Evaporation Material (Wire, 99.999%, Dia. 0.5 mm) is a high-purity metal wire designed for thermal evaporation, but requires precise source matching and process calibration due to its melting point and Z-ratio.
Positive
- High-purity 99.999% copper: The 99.999% purity specification minimizes contamination in thin-film depositions, critical for research and device applications requiring low impurity levels.
- Wire form with 0.5 mm diameter: The wire form factor and precise 0.5 mm diameter facilitate consistent loading into thermal evaporation sources, supporting reproducible deposition rates.
Trade-offs
- Melting point and Z-ratio constraints: The melting point of 1083 °C and Z-ratio of 0.437 require careful calibration of evaporation source parameters and thickness monitoring to achieve targeted film properties.
- Deposition-source compatibility required: The evaporation material must be matched to W/Mo/Ta filament, basket, coil, or boat sources; improper source selection may lead to incomplete evaporation or contamination.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
