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Copper (Cu) Evaporation Material, Wire, 99.99%, Dia. 0.5 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The evaporation of this copper wire imposes constraints on source material compatibility, process temperature, and deposition controller settings. Additionally, the wire form and diameter require verification of source loading geometry prior to use.
- Evaporation Source Compatibility: The wire requires a thermal evaporation source constructed from tungsten, molybdenum, or tantalum.
- Process Parameter Configuration: The deposition controller must be set with the material's density of 8.92 g/cm³ and Z-ratio of 0.437 for accurate rate monitoring.
- Source Geometry Confirmation: The wire diameter of 0.5 mm must be compatible with the source's loading geometry to ensure uniform feed and evaporation.
- Melting Point Requirement: The evaporation process must reach the material's melting point of 1083°C to achieve vaporization.
What is the significance of the Z-ratio of 0.437 for this copper wire in thermal evaporation process control?
The Z-ratio of 0.437 is a material-specific acoustic impedance factor used to calibrate quartz crystal microbalance (QCM) thickness monitors during thermal evaporation. This value, explicitly stated for this copper wire, ensures accurate film thickness measurement when using a QCM sensor, as the tooling factor must be adjusted based on the material's Z-ratio. An incorrect setting can lead to systematic thickness errors in deposited films.
Is this 0.5 mm diameter copper wire compatible with e-beam evaporation systems, or is it limited to thermal/resistive methods?
This copper wire is specifically designed for thermal/resistive evaporation using W/Mo/Ta filaments, baskets, coils, or boats. It is not explicitly rated for e-beam evaporation, which typically requires different material forms (e.g., pellets, rods) or crucible liners to withstand the high-energy electron beam. For e-beam compatibility, confirm with the supplier whether the wire form and crucible materials are suitable for your system.
Why is the wire diameter specified as 0.5 mm, and how does it affect source loading and evaporation consistency?
The 0.5 mm diameter is specified to support reliable source loading and controlled evaporation in thermal evaporation hardware. This wire size ensures consistent feeding through filament coils or baskets, prevents mechanical bridging or spitting, and provides a uniform melt pool for reproducible deposition rates. The diameter is optimized for standard thermal sources like W/Mo/Ta boats and baskets.
This 99.99% pure copper wire (0.5 mm diameter) is designed for thermal evaporation in vacuum thin-film deposition, providing a defined purity and form factor to support consistent film quality. Its compatibility with W/Mo/Ta filament, basket, coil, or boat sources and available pack sizes (100g–1kg) enable scalable laboratory process development.
Positive
- High purity 99.99%: The 99.99% purity specification minimizes contamination risk in thin-film deposition, ensuring reproducible film properties for research-grade applications.
- Defined wire form and diameter: Wire form with 0.5 mm diameter facilitates uniform loading and consistent evaporation from standard thermal sources (W/Mo/Ta filament, basket, coil, or boat), supporting reliable process control.
Trade-offs
- Evaporation source compatibility required: This material is intended for use with W/Mo/Ta filament, basket, coil, or boat sources; alternative evaporation hardware may not achieve proper deposition without process modification.
- Process parameter matching necessary: The melting point (1,083°C) and density (8.92 g/cm³) require precise calibration of evaporation temperature and rate; users must match source geometry and power settings to avoid film quality issues.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
