Copper Disk Working Electrode 2–4mm SEM/AFM ATOMFAIR®

$96.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade copper disk working electrode with 2–4mm diameter, <4mm head thickness, and gold-plated 1.5×15mm rod for SEM/AFM electrochemistry. Order now.

Multifunctional Combination Copper Working Electrode Series | ATOMFAIR

RESEARCH GRADE INSTRUMENT

Product Overview

The ATOMFAIR® Multifunctional Combination Copper Working Electrode features a high-performance copper disk as the active sensing surface, offering excellent conductivity and specific electrochemical behavior for copper electrodeposition, stripping analysis, and biosensor applications. The electrode incorporates an embedded disk design with diameters available from 2mm to 4mm, accommodating diverse experimental scales from micro-electrode sensing to macro-electrode bulk electrolysis. The electrode head thickness is less than 4mm, enabling use as a standard working electrode for conventional electrochemical measurements as well as direct integration with scanning electron microscopy (SEM) or atomic force microscopy (AFM) systems. This dual-purpose design bridges bulk electrochemistry and high-resolution surface characterization, allowing researchers to correlate electrochemical performance with structural and topographical features on the identical electrode surface.

Technical Specifications

PARAMETER DETAILS
1. Core Device & Electrochemical Design
Electrode Geometry Modular detachable configuration
Electrode Head Thickness Less than 4mm
Compatible Techniques Conventional electrochemistry, SEM, AFM
2. Electrode Material Portfolio Parameters
Material Copper
Diameter Options 2~4mm

Key Features & Advantages

  • Correlative Electrochemical-Microscopic Analysis: Enables direct structural and topographical correlation with electrochemical data from the identical electrode location without sample transfer.

  • Specialized Copper Material: Constructed from high-grade copper, providing excellent electrical conductivity and specific electrochemical characteristics suitable for electrocatalytic research, sensor development, corrosion studies, and targeted redox systems.

  • Robust Corrosion Protection: Gold-plated copper rod (1.5x15mm) delivers enhanced oxidation resistance and maintains stable conductivity over extended use.

  • Flexible Diameter Selection: Available in 2mm to 4mm diameter range, accommodating various experimental requirements and allowing researchers to select the optimal size for their specific application.

APPLICATION SCOPE: Healthcare, Environmental Monitoring, Chemical Engineering, Bio-industry, and Advanced Energy Systems.
PACKAGING: Secure individual research-grade protective containers with shock-absorption parameters.
IMPORTANT NOTICE: This product is highly sensitive to surface contamination. Keep containers tightly sealed or handle exclusively within an anhydrous inert environment to prevent phase contamination or degradation before electrochemical validation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
EMAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

The copper electrode surface is susceptible to contamination and oxidation upon exposure to ambient conditions. All handling and storage must occur within a sealed anhydrous inert environment to preserve electrochemical integrity.

  • Surface Contamination Risk: The electrode surface must be inspected for any visible or chemical contamination before each use to ensure data reliability.
  • Inert Atmosphere Handling: Transfer the electrode to an anhydrous inert environment immediately after removing it from its sealed container.
  • Storage Protocol: Store the electrode in its original sealed container within an inert atmosphere when not in use to prevent degradation.

This procedure describes the necessary steps to safely handle and prepare the electrode for electrochemical measurements. Proper handling prevents surface contamination and ensures reproducible performance.

Required Equipment: Anhydrous inert environment (e.g., glovebox)

  1. Inspect electrode surface
    Inspect the electrode surface for visible contamination or physical damage before each use.
  2. Transfer to inert environment
    Transfer the electrode to an anhydrous inert environment immediately if the container has been opened outside such an atmosphere.
  3. Store after use
    Store the electrode in its sealed container within the inert environment after completion of measurements.

How does the electrode head thickness under 4mm affect electrochemical measurement accuracy compared to standard thicker working electrodes?

The sub-4mm head thickness minimizes ohmic drop and stray capacitance, preserving signal fidelity in high-speed cyclic voltammetry and impedance spectroscopy. This design also enables direct SEM/AFM integration without sample transfer, allowing correlative analysis on the identical copper surface. The thin profile does not compromise the embedded disk seal, maintaining a defined active area for reproducible current density calculations.

Can this copper working electrode be used directly in an SEM or AFM chamber without additional adapters or modifications?

Yes, the electrode head thickness of less than 4mm is specifically designed for direct integration with SEM and AFM systems, enabling in situ or ex situ surface characterization. The modular detachable configuration allows the head to be mounted on standard microscope stages. However, the product must be handled exclusively within an anhydrous inert environment to prevent surface contamination before electrochemical validation.

What specific handling and storage conditions are required to prevent copper surface oxidation before electrochemical experiments?

The copper disk is highly sensitive to surface contamination; containers must be kept tightly sealed or handled exclusively within an anhydrous inert environment to prevent phase contamination or degradation. The gold-plated copper rod (1.5x15mm) provides enhanced oxidation resistance for the electrical contact, but the active copper surface requires rigorous protection. Storage in a desiccator or glovebox under argon or nitrogen is recommended until immediate use.

This copper working electrode enables correlative electrochemical-microscopic analysis without sample transfer, but its thin head design and copper surface demand strict anhydrous inert handling to prevent contamination.

Positive

  • Correlative electrochemical-microscopic analysis: The electrode head thickness under 4mm allows direct integration with SEM or AFM, enabling structural and topographical correlation with electrochemical data from the identical surface without sample transfer.
  • Gold-plated corrosion protection: The 1.5x15mm gold-plated copper rod provides enhanced oxidation resistance and maintains stable electrical conductivity over extended use.

Trade-offs

  • Surface contamination sensitivity: The electrode is highly sensitive to surface contamination; containers must be kept tightly sealed or handled exclusively within an anhydrous inert environment to prevent phase contamination or degradation before electrochemical validation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).