Zirconia Ceramic Plate, 100 mm x 100 mm x 10 mm, WhiteProduct Type: Zirconia ceramic plate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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This zirconia ceramic plate exhibits high hardness and compressive strength but is susceptible to thermal shock above 350 °C. The material requires careful thermal management to prevent cracking from rapid temperature changes.
- Thermal Shock Constraint: Do not subject the plate to temperature gradients exceeding 350 °C to avoid fracture from thermal shock.
- Electrical Insulation Constraint: Maintain surface cleanliness to preserve volume resistivity above 1 × 10¹² Ω·cm for reliable electrical insulation.
- Mechanical Loading Constraint: Avoid point loading beyond the compressive strength of 25,000 kgf/cm² to prevent localized failure.
This procedure describes safe handling and installation of a zirconia ceramic plate for high-temperature or electrical insulation applications. Proper thermal management and mechanical support are critical to prevent damage.
Required Equipment: Cleanroom gloves, Soft support surface
- Inspect the plate
Inspect the plate for visible cracks, chips, or surface defects before handling. - Clean the surface
Wipe the plate with a lint-free cloth and isopropyl alcohol to remove any particulate contamination. - Position on support
Place the plate on a flat, soft support surface to distribute load evenly and prevent stress concentration. - Apply thermal ramp
Heat or cool the plate at a rate not exceeding 350 °C per hour to avoid thermal shock. - Verify electrical isolation
Measure volume resistivity with a megohmmeter to confirm insulation integrity before energizing.
How does the thermal shock resistance of 350°C affect the use of this zirconia plate in rapid temperature cycling experiments?
The product specification lists a thermal shock resistance of 350°C, which is the maximum temperature differential the plate can withstand without failure. Combined with a maximum service temperature of 1600°C and a low thermal expansion coefficient of 10×10⁻⁶/°C, the plate can tolerate moderate thermal gradients but may require controlled ramp rates to avoid cracking when the shock limit is approached.
Can this 94% zirconia ceramic plate be used for electrical insulation in high-temperature furnace applications?
Yes. The plate has a volume resistivity greater than 1×10¹⁰ Ω·cm and a dielectric breakdown strength of 15 kV/mm, with a maximum service temperature of 1600°C. These properties confirm its suitability for electrical insulation in high-temperature environments up to 1600°C, provided thermal shock limits are respected.
What sintering temperature was used to produce this zirconia plate and does it affect the material's final properties?
The source specifies a sintering temperature of 1650°C. This high-temperature densification yields a fully dense structure with 0% water absorption, a density of 5.9 g/cm³, and a flexural strength exceeding 11,000 (units unspecified), ensuring low porosity and high mechanical integrity for demanding research applications.
The 100 mm x 100 mm x 10 mm white zirconia ceramic plate (≥94% ZrO₂) offers high hardness (1400 HV), compressive strength (25,000 kgf/cm²), and a maximum service temperature of 1600 °C, making it suitable for demanding high-temperature and wear-resistant lab applications, though its low thermal conductivity (3 W/(m·K)) and limited thermal shock resistance (350 °C) require careful thermal management.
Positive
- High-temperature stability: Maximum service temperature of 1600 °C and sintering at 1650 °C enable use in high-temperature furnaces and thermal processes without dimensional loss.
- Excellent electrical insulation: Volume resistivity above 1 × 10¹⁰ Ω·cm and dielectric breakdown strength of 15 kV/mm provide reliable insulation for high-voltage or electronic test setups.
Trade-offs
- Low thermal conductivity limits heat dissipation: With a thermal conductivity of only 3 W/(m·K), the plate acts as a thermal barrier, which may restrict heat transfer in applications requiring rapid thermal equilibration.
- Moderate thermal shock resistance: Thermal shock resistance of 350 °C means rapid temperature changes must be avoided to prevent cracking, requiring controlled heating and cooling ramps.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
