96% Alumina Ceramic Substrate, 25 mm x 25 mm x 1 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What surface roughness tolerance does the 96% alumina ceramic substrate have and how does it affect thin film metallization adhesion?
The substrate specifies a surface roughness of Ra 0.15–0.30 μm. This controlled finish supports consistent adhesion for thin film metallization processes; rougher surfaces can degrade film uniformity while smoother surfaces may reduce mechanical interlocking. The stated range is typical for applications requiring both good adhesion and fine line resolution.
Is this 25 mm x 25 mm x 1 mm alumina substrate suitable for high-frequency RF or microwave circuit substrates?
Yes, the material is characterized by low dielectric constant and low dielectric loss, combined with a thermal conductivity >24 W/(m·K) and breakdown voltage ≥15 kV/mm. These properties make it suitable for RF/microwave circuits where signal integrity, thermal management, and electrical isolation are critical. However, for exact impedance matching, the dielectric constant at the operating frequency should be confirmed with the manufacturer.
What handling precautions are recommended for 96% alumina ceramic substrates due to their brittleness?
Despite a flexural strength >350 MPa and Vickers hardness of 14 GPa, the substrate is a brittle ceramic. Use clean, cushioned handling tools to avoid edge chipping or surface scratches. Store in a dry, clean environment to prevent moisture absorption that could affect surface cleanliness or metallization adhesion. Always inspect for microcracks before processing.
This 96% alumina ceramic substrate (25 mm x 25 mm x 1 mm, pack of 50) provides a high-density (≥3.70 g/cm³), high-strength (~350 MPa flexural) platform for electrical insulation and thermal management in lab-scale device prototyping, though its moderate thermal conductivity (~24 W/(m·K)) and fine surface roughness (Ra 0.15–0.30 μm) introduce bonding or metallization considerations.
Positive
- High electrical breakdown voltage: With a breakdown voltage of ≥15 kV/mm, this substrate provides reliable electrical insulation for high-voltage or power-dense thin-film and microelectronic applications.
- Robust mechanical and chemical durability: Flexural strength >350 MPa and Vickers hardness of 14 GPa, combined with good corrosion resistance and chemical stability, ensure structural integrity under thermal cycling and exposure to aggressive lab environments.
Trade-offs
- Moderate thermal conductivity for alumina: Thermal conductivity >24 W/(m·K) is useful but lower than high-purity alumina or aluminum nitride substrates, which may limit heat dissipation in high-power-density circuits without thermal management design.
- Surface roughness requires confirmation for thin-film processes: Specified surface roughness of Ra 0.15–0.30 μm may not be sufficiently smooth for direct thin-film metallization or photolithographic patterning without additional polishing, increasing processing steps.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
