96% Alumina Ceramic Substrate, 27.3 mm x 27.3 mm x 1 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
|
This document defines the configuration and post-processing constraints for the 96% alumina ceramic substrate supplied as the selected independent specification. Confirm dimensional, surface, and optional processing requirements before integrating the substrate into an application.
- Configuration Confirmation: Verify size tolerance, thickness requirement, material grade, surface finish, and package format before use.
- Post-Processing Option Matching: Confirm polishing, coating, metallization, or custom-shape needs when the target application requires them.
What is the thermal conductivity of the Atomfair 96% alumina ceramic substrate?
The thermal conductivity is >24 W/(m·K), as specified in the technical data for this 96% alumina ceramic substrate.
What is the breakdown voltage of this 96% alumina substrate, and is it suitable for high-voltage insulation?
The breakdown voltage is ≥15 kV/mm, making it suitable for high-voltage insulation applications as stated in the product specifications.
What are the mechanical properties of this 96% alumina ceramic substrate that affect handling and machining?
The substrate has a flexural strength >350 MPa and Vickers hardness 14 GPa, indicating high strength and hardness but also brittleness, so careful handling is required to avoid chipping.
This 96% alumina ceramic substrate (27.3 mm x 27.3 mm x 1 mm, pack of 50) offers high mechanical strength (>350 MPa flexural), electrical insulation (≥15 kV/mm breakdown voltage), and thermal conductivity (>24 W/m·K), balanced by a surface roughness of Ra 0.15–0.30 μm that may require post-processing for precision thin-film or photolithography applications.
Positive
- High electrical insulation and breakdown strength: With a breakdown voltage ≥15 kV/mm, this substrate provides reliable electrical isolation for high-voltage or power electronics applications, reducing risk of dielectric failure.
- Combined thermal and mechanical robustness: Thermal conductivity >24 W/m·K and flexural strength >350 MPa enable effective heat dissipation and structural integrity under mechanical or thermal cycling typical in lab fixtures or device prototyping.
Trade-offs
- Surface roughness restricts precision coatings: The as-fired surface roughness of Ra 0.15–0.30 μm may exceed requirements for thin-film deposition or photolithographic patterning; post-processing such as polishing or lapping is likely needed for submicron film adhesion.
- Limited substrate ductility for machining: Alumina ceramic's high hardness and intrinsic brittleness preclude standard cutting or drilling without diamond tooling; users must order custom shapes or plan for laser or ultrasonic machining for non-standard geometries.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
